Socket Apparium With Corner Datum For Chip Alignment

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Solution Overview

Problem

Existing socket structures for connecting chip packages to circuit boards suffer from movement and rotation issues, leading to unreliable electrical connections due to manufacturing tolerances and assembly requirements.

Innovation Solution

A socket apparatus with uniformly oriented pins that deflect in a uniform direction, causing the pins to wipe towards a first corner of the socket, ensuring consistent contact with the chip package's electrical pads and maintaining a secure connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If socket openings are designed to be larger than the package size to accommodate manufacturing tolerances, then packages can be assembled into the socket, but the packages become prone to movement and rotation within the socket structure

Engineering Contradiction:
Improveassembly tolerance accommodationVSAvoidconnection stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies local quality by creating a corner datum structure at a specific location (first corner) of the socket opening. This localized feature provides a reference point that guides package placement without requiring the entire socket opening to be precisely fitted. The corner datum structure includes a protrusion or feature that engages with a corresponding feature on the package, creating a localized constraint that prevents movement and rotation while still allowing manufacturing tolerances elsewhere in the assembly.

Inventive Principle:
Principle #3Local quality

2Ease of operation

If packages are placed within the socket structure with free play governed by dimensional tolerances, then assembly is easier, but electrical opens occur where signal paths are broken

Engineering Contradiction:
Improvepackage placementVSAvoidelectrical connection integrity
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-configuring the corner datum structure in the socket opening before package placement. This corner datum feature is预先 designed to guide the package into the correct position and orientation as it is being inserted. The structure proactively prevents misalignment and ensures that electrical contacts are properly engaged from the moment of insertion, rather than relying on post-assembly adjustments or hoping for tolerance-based luck.

Inventive Principle:
Principle #10Preliminary action

3Loss of time

If sockets provide flexibility for testing and validation independent of CPU, then development time is saved, but connection reliability between chip package and circuit board deteriorates due to movement

Engineering Contradiction:
Improvedevelopment cycle timeVSAvoidelectrical connection reliability
Core Design Contradiction:
Loss of timeVSReliability

Solution Approach 1:

The patent applies asymmetry by designing the corner datum structure with a specific directional orientation (first corner vs. other corners). This asymmetric feature creates a unique reference point that prevents rotation of the package within the socket. The asymmetric design ensures that the package can only be inserted in the correct orientation, thereby maintaining reliable electrical connections while still providing the flexibility needed for independent testing and validation activities during development.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a reliable and secure electrical connection between the chip package and the circuit board by ensuring consistent alignment and contact, accommodating dimensional variations between the socket and chip package, and preventing movement-induced failures.

Implementation Method 1

a plurality of uniformly oriented pins deflecting in a uniform direction and parallel to one another, such that when a plurality of electrical pads of the chip package come into contact with the plurality of uniformly oriented pins and a load is applied to the top surface of the socket apparatus, the plurality of uniformly oriented pins are configured to wipe in a uniform direction towards a first corner

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS20250189557A1Socket apparatus for secure placement of chip package
Publication Date: 2025.06.12 MICROSOFT TECHNOLOGY LICENSING LLC
  • US20250189557A1 patent drawing
  • US20250189557A1 patent drawing
  • US20250189557A1 patent drawing

AI summary

The present disclosure relates to a socket apparatus that includes a socket cavity sized and configured to receive a chip package. The socket apparatus further includes a plurality of base contacts on a bottom surface of the socket apparatus, the plurality of base contacts being mountable on a circuit board. The socket apparatus further includes a plurality of pins positioned across a top surface of the socket apparatus opposite the bottom surface, each pin of the plurality of pins having a location that is referenced relative to a datum reference. The datum reference is positioned in a first corner of the socket apparatus to improve alignment accuracy between socket pins and package pads.