Socket Movable Arm Cuneiform Actuator Latching Reliability

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Solution Overview

Problem

Conventional sockets face issues with reliably latching semiconductor packages due to insufficient rotational force from springs, which can be exacerbated by increased elastic coefficients requiring additional driving force, leading to instability in the latching mechanism.

Innovation Solution

The socket design incorporates pivotally assembled movable arms with a cuneiform actuating portion and a horizontal latching portion, utilizing a combination of springs to generate a significant rotational moment for reliable latching, where the actuating portion's cuneiform surface and spring configuration ensure secure engagement with the semiconductor package.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the elastic coefficient of springs is increased to enhance the rotational moment, then the latching reliability is improved, but the driving force required increases beyond the capability of the pressure equipment

Engineering Contradiction:
Improvelatching reliabilityVSAvoiddriving force
Core Design Contradiction:
ReliabilityVSForce

Solution Approach 1:

The movable frame is divided into two functional parts: a first movable frame portion that receives the semiconductor package and a second movable frame that applies pressure. This segmentation allows the springs to act on the second movable frame, which then transmits force through the cuneiform actuating portion to rotate the movable arms, achieving reliable latching without requiring excessive driving force

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cuneiform actuating portion introduces a geometric dimension to the force transmission mechanism. The inclined surface of the cuneiform structure converts the vertical upward movement of the second movable frame into a rotational moment about the pivot point, amplifying the effective torque without increasing the spring elastic coefficient or driving force

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the elastic coefficient of springs is increased to enhance the rotational moment, then the latching reliability is improved, but the device complexity increases due to additional driving force requirements

Engineering Contradiction:
Improvelatching reliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By segmenting the movable frame into two portions with distinct functions, the design achieves reliable latching through the cuneiform actuating mechanism without requiring additional driving components, thereby maintaining device simplicity while improving reliability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cuneiform actuating portion and movable arm configuration enable the system to generate sufficient rotational moment through its own geometric design and spring mechanism, without requiring external assistance or additional complex driving components

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the rotational moment, enabling reliable latching and secure retention of semiconductor packages with improved stability and reduced reliance on external driving forces, ensuring consistent performance across varying pressure equipment inputs.

Implementation Method 1

the movable frame moves upwardly to an original position by resilience force of a plurality of springs

Methodology Applied
Scientific EffectElastic force: Elasticity

Implementation Method 2

the actuating portion being formed with a cuneiform outside surface

Methodology Applied
Scientific EffectMechanical advantage through wedge geometry: Wedge

Data Source

PatentUS7588450B2Socket
Publication Date: 2009.09.15 HON HAI PRECISION INDUSTRY CO LTD
  • US7588450B2 patent drawing
  • US7588450B2 patent drawing
  • US7588450B2 patent drawing

AI summary

A socket, for receiving a semiconductor package, has an insulating base receiving a plurality of contacts, a plurality of movable arms, a first movable frame, a second movable frame and a plurality of springs urging the movable arms. Each movable arm defines am opening position and a close position relative to the insulating base, The movable arm has an actuating portion with a free end and a cuneiform outside surface, a horizontal portion extending from the actuating portion for pressing the semiconductor package and a pair of bores on a bottom part of the actuating portion. A haulm passes through the bores to assemble the movable arm to the insulating base.