Socket Pin Field Dust Cap Automatic Release Mechanism
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Solution Overview
Problem
Grid array sockets in information handling systems are prone to damage during assembly due to inadvertent contact with foreign objects or contaminants, particularly when removing dust caps, which can cause damage to the pin field.
Innovation Solution
A system and method where a dust cap covers the socket pin field, interacting with a load mechanism to automatically release and lift away from the socket, minimizing the risk of damage during processor installation, by coupling to the load plate and using a mechanical attachment device to translate a release force, ensuring the cap is removed without dragging or falling onto the pin field.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the dust cap is removed manually after load mechanism assembly, then the processor can be installed, but the socket pin field is at risk of damage from inadvertent contact with the cap or foreign objects
Solution Approach 1:
The dust cap is pre-positioned on the socket before load mechanism assembly, and the load mechanism is designed to automatically interact with the cap during its closing operation. This preliminary positioning and automated interaction eliminates the need for manual cap removal, thereby preventing damage to the pin field while facilitating processor installation.
Solution Approach 2:
The load mechanism is designed to automatically remove the dust cap through its own closing motion without requiring separate manual intervention. The cap's attachment device interacts with the load mechanism's load plate, allowing the load mechanism itself to perform the cap removal function, thus eliminating harmful manual handling.
2Object-affected harmful factors
If the dust cap is kept on the socket throughout assembly, then the pin field is protected, but the cap may fall onto or drag across the pin field causing damage during removal
Solution Approach 1:
The attachment device acts as an intermediary mechanism between the dust cap and the load mechanism. It provides a controlled interaction point where the load mechanism can safely engage and remove the cap without direct contact between the cap and the vulnerable pin field, thereby maintaining protection during removal.
Solution Approach 2:
The manual mechanical removal process is replaced with an automated mechanical interaction between the load mechanism and the cap's attachment device. This substitution eliminates the unpredictable manual handling that could cause damage, replacing it with a controlled, designed mechanical interaction that safely removes the cap.
3Productivity
If automated assembly processes are used, then productivity increases, but the risk of damage to the socket pin field increases due to robotic arm operations
Solution Approach 1:
The system is designed so that the load mechanism automatically performs the cap removal function as part of its own operation, without requiring separate robotic intervention. This self-service approach maintains the benefits of automated assembly while eliminating the risks associated with robotic arms contacting the vulnerable pin field.
Solution Approach 2:
The dust cap is extracted or removed from the socket area by the load mechanism's automated operation, clearing the protective barrier at the appropriate time without requiring additional automated handling steps that could expose the pin field to damage risks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the socket pin field from damage during assembly by ensuring the dust cap is removed without contact with the pin field, reducing the risk of damage and facilitating automated assembly processes, such as those using robotic arms, until the processor is installed, thus safeguarding the socket throughout the assembly process.
Implementation Method 1
The socket pin field is an array of spring contacts that are deflected and provide a contact normal force between the CPU substrate via gold pads on the substrate and the gold plated spring contacts. Deflection with springs provides a minimum contact pressure for good contact to CPU circuitry with minimal resistance.
Data Source
AI summary
A grid array socket pin field is protected during manufacture of an information handling system with a dust cap having first and second attachment devices. The first attachment device secures the cap to the socket during assembly of the socket in the computer. The second attachment device secures the cap to a load mechanism assemble proximate the socket. Engagement of the second attachment device to the cap automatically releases the cap from the socket to allow removal of the cap from the socket by actuation of the load mechanism to an open position. The second attachment device secures the cap to the load mechanism until a processor is placed in the socket.