Semiconductor Socket Elastic Contact for Gull-Wing Lead Stability
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Solution Overview
Problem
Conventional two-point-contact type semiconductor package sockets risk deforming gull-wing leads due to increased contact pressure, especially in high-density packages with smaller lead diameters, leading to potential poor electric contact.
Innovation Solution
A two-point-contact type semiconductor package socket design featuring a socket base with a package rest and a cover member, utilizing elastic deforming contact pieces that make contact with both the horizontal shoulder and vertical leg portions of gull-wing leads, allowing for adjustable contact pressure to prevent lead deformation and ensure stable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the contact portion makes horizontal contact with the lead leg portion to ensure stable contact, then the contact stability is improved, but the contact pressure increases causing lead deformation
Solution Approach 1:
The patent changes the contact pressure parameter by introducing elastic deforming portions that control and limit the contact pressure to a predetermined level, preventing lead deformation while maintaining stable contact
Solution Approach 2:
The contact structure incorporates elastic deforming portions that allow dynamic adjustment of contact pressure, enabling the contact to adapt to lead position variations while maintaining stable electrical connection without excessive pressure
2Productivity
If the number of leads increases to increase package density, then the productivity is improved, but the lead diameter decreases increasing the risk of lead deformation
Solution Approach 1:
The patent changes the contact pressure parameter to a predetermined level that is safe for thin leads, allowing high-density packages with smaller lead diameters to be tested without deformation risk
3Reliability
If the contact pressure is increased to ensure positive soldering, then the reliability is improved, but the lead may be deformed
Solution Approach 1:
The patent optimizes the contact pressure parameter to a predetermined level that provides sufficient force for reliable electrical connection and soldering quality without exceeding the threshold that would cause lead deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses lead deformation and prevents poor electric contact by distributing contact pressure evenly, ensuring reliable connections without damaging the gull-wing leads.
Implementation Method 1
a cover member (20) vertically movably attached on the socket base (10) through an elastic member (29)
Implementation Method 2
the first contact piece (31) and the second contact piece (32), of the contact (30), each having an elastic deforming portion (35, 54) that is elastically deformable to determine a contact pressure
Data Source
AI summary
A semiconductor package socket (1, 101) has a socket base (10, 110) including a package rest (11, 111) on which a semiconductor package (50) having gull-wing leads (52) is put, a cover member (20, 120) movably attached on the socket base, and a plurality of contacts (30, 130) each including a first contact piece (31, 131) capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece (32, 132) capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.