Socket for Electrical Tester Testing Both Sides of Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional sockets for electrical testers can only test connecting terminals on one side of semiconductor packages, requiring complex configurations and inability to test laminated semiconductor packages effectively.
Innovation Solution
A socket design featuring first and second contact boards with connection structures that allow simultaneous electrical contact and testing of both sides of semiconductor packages, including a third contact board for laminated packages, simplifying the test current provision and enabling testing of both sides without additional current paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional socket with separate first and second connecting pins is used to test both sides of semiconductor packages, then the ability to test both sides simultaneously is improved, but the device complexity increases due to complicated configuration for providing test current
Solution Approach 1:
The patent combines the first and second connecting pins into a single integrated connecting pin structure. The first connecting pin tests the bottom connection terminal while the second connecting pin tests the top connection terminal, both through a unified pin design that simplifies the test current provision configuration while maintaining the capability to test both sides of the semiconductor package simultaneously.
Solution Approach 2:
The connecting pin is designed with multi-functional capability to perform both first connection terminal testing and second connection terminal testing. This universal design allows a single pin structure to fulfill multiple testing functions, eliminating the need for separate complex configurations for each side of the semiconductor package.
2Adaptability or versatility
If a conventional socket is used, then the configuration remains simple, but the ability to test laminated semiconductor packages is lost
Solution Approach 1:
The patent extends the testing capability from a single-plane configuration to a multi-layer stacked configuration. The connecting pin is designed to penetrate through multiple laminated semiconductor packages, enabling testing in the vertical dimension. This allows simultaneous testing of top and bottom connection terminals across multiple stacked packages without significantly increasing horizontal complexity.
3Productivity
If the semiconductor package is turned over to test the other side, then the socket configuration remains simple, but the testing time increases
Solution Approach 1:
The patent enables continuous testing of both sides of the semiconductor package without interruption or repositioning. The dual-connecting pin structure allows simultaneous application of test currents to both top and bottom connection terminals, eliminating the need to stop testing, turn over the package, and reposition it. This continuous testing capability significantly improves productivity while maintaining a relatively simple socket configuration.
Data Source
AI summary
A socket for an electrical tester is disclosed. The socket includes a first contact board being arranged at a bottom side of a test object, and a second contact board being arranged at a top side of the test object. The first contact board includes a first contact member and a first conductive connection member, wherein the first contact member is electrically connected to a bottom connection terminal formed on the bottom side of the test object, and the first conductive connection member is isolated from the test object. The second contact board includes a second contact member, wherein the second contact member is electrically connected to the first conductive connection member and a top connection terminal formed on a top side of the test object, respectively. Therefore, the socket can have a simple configuration for providing the test current.