Socket Engaging Clump Prevents IC Mis-mating

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Solution Overview

Problem

Existing electrical connectors for IC packages and printed circuit boards face issues with mis-mating due to projections near contact passageways, which can interfere with contact assembly and result in unreliable retention of detachable keys.

Innovation Solution

A socket design featuring an insulative housing with engaging clumps that include a post and transverse arm to securely position and retain the IC package, preventing offset insertion and ensuring reliable assembly without interfering with contact placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If projections are formed on inner sides of sidewalls to engage with gaps on IC package, then mis-mating is prevented, but the projections interfere with contact assembly in passageways

Engineering Contradiction:
Improveprevention of mis-matingVSAvoidinterference with contact assembly
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The engagement structure is segmented into separate components: the insulative housing contains the contacts and passageways, while the detachable key is a separate element that engages with the IC package gaps. This segmentation allows the key to perform the engagement function without interfering with contact assembly in the housing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The engagement function is extracted from the insulative housing by using a detachable key that can be removed. The key is inserted into recesses formed in the bottom wall of the housing, separating the engagement mechanism from the contact assembly structure.

Inventive Principle:
Principle #2Taking out (Extraction)

2Device complexity

If detachable keys are used to engage with gaps on IC package, then contact assembly is not interfered with, but the keys are unreliably retained and easily drop from the housing

Engineering Contradiction:
Improvenon-interference with contact assemblyVSAvoidretention of detachable key
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The detachable key incorporates elastic elements (springs) that provide dynamic retention force. The elastic elements allow the key to be inserted and removed while maintaining reliable engagement during use, combining ease of assembly with secure retention.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The detachable key merges multiple functions into a single component: engagement with IC package gaps, positioning of the package, and retention through elastic elements all integrated in one key structure.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If simple configuration is used for connector, then manufacturing is easier, but projections near passageways influence contact assembly

Engineering Contradiction:
Improvesimple configurationVSAvoidcontact assembly precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The connector is segmented into the insulative housing containing contacts and the separate detachable key for engagement. This simple segmentation maintains ease of manufacture while eliminating interference with contact assembly precision.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS7938665B2Socket having engaging clump
Publication Date: 2011.05.10 HON HAI PRECISION INDUSTRY CO LTD
  • US7938665B2 patent drawing
  • US7938665B2 patent drawing
  • US7938665B2 patent drawing

AI summary

A socket, for electrically connecting an IC package with gaps on two sides thereof and a printed circuit board, comprises an insulative housing, a plurality of contacts received in the insulative housing and a pair of engaging clumps. The insulative housing has a bottom wall and a plurality of sidewalls upwardly extending from the bottom wall, the sidewalls and the bottom wall together define a space for the IC package, two opposed sidewall further have engaging slots. The engaging clump is received in the engaging slot, and has a post entering into the space to engaging with the gap of the IC package and a transverse arm abutting against and position the IC package.