Socket Frame Alignment Without Substrate Holes
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Solution Overview
Problem
The increased manufacturing complexity and reduced mechanical integrity of substrates due to the formation of holes for socket alignment in integrated circuits, particularly as substrates grow larger, pose challenges in aligning optical circuits effectively without compromising structural integrity.
Innovation Solution
The use of a frame with slots or grooves on the substrate, where sockets with keying features or pegs are aligned without forming holes through the substrate, utilizing epoxy or solder to secure the sockets in place, ensuring proper alignment and connection of optical circuits without compromising the substrate's mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If holes are formed through the substrate to position and align sockets, then socket alignment is achieved, but manufacturing complexity increases and mechanical integrity deteriorates
Solution Approach 1:
The patent extracts the alignment function from the substrate itself by introducing a separate frame structure. The frame contains slots that receive sockets, providing alignment features without requiring holes through the substrate. This separates the alignment function from the substrate, eliminating the need for complex hole formation processes while maintaining precise socket positioning.
Solution Approach 2:
The frame acts as an intermediary component between the substrate and the sockets. Instead of directly forming holes in the substrate for socket alignment, the frame provides slots with alignment features that guide and position the sockets. This intermediary structure simplifies manufacturing by avoiding substrate modification while achieving precise alignment.
2Manufacturing precision
If holes are formed through the substrate to position and align sockets, then socket alignment is achieved, but mechanical integrity is reduced causing cracks or warpage
Solution Approach 1:
The alignment function is extracted from the substrate and transferred to the frame structure. The frame contains slots with built-in alignment features that position sockets without requiring any holes through the substrate. This preserves the substrate's mechanical integrity by eliminating the stress concentrations and structural weaknesses that would result from through-holes.
Solution Approach 2:
The frame serves as a mediator that provides the alignment function without compromising the substrate. The slots in the frame guide and position the sockets, eliminating the need for holes in the substrate that would reduce its mechanical strength and cause cracks or warpage.
3Strength
If a frame with slots is used to align sockets without holes, then mechanical integrity is enhanced, but manufacturing precision for socket alignment must be maintained
Solution Approach 1:
The frame acts as an intermediary that provides precise alignment through its slot design. The slots incorporate alignment features such as keyways or tapered sections that guide sockets into correct positions. This intermediary structure maintains manufacturing precision while preserving substrate integrity by avoiding holes.
Solution Approach 2:
The frame slots are designed with asymmetric alignment features that provide precise positioning in critical directions while maintaining flexibility in others. The asymmetric geometry of the slots and corresponding socket features ensures accurate alignment without requiring holes through the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient alignment and connection of optical circuits with the substrate, enhancing mechanical integrity and reducing manufacturing complexity by eliminating the need for holes, thereby improving the reliability and stability of the integrated circuit assembly.
Implementation Method 1
The socket includes a peg. The socket aligns with an attachment location on the substrate when the peg mates with the groove. The epoxy or solder holds the peg in the groove.
Data Source
AI summary
An apparatus includes a substrate, a frame, and a socket. The frame defines a slot. The frame is coupled to the substrate such that the slot is aligned with an attachment location on the substrate. The socket receives a first device. The socket aligns with the attachment location on the substrate when the socket is inserted in the slot.