Electric Connection Socket Ground Voltage Stabilization
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Solution Overview
Problem
Existing electrical connection sockets experience unstable ground voltage due to impedance generated by contact resistance between the ground pin and the metal housing, leading to signal degradation during high-frequency signal transmission.
Innovation Solution
The electrical connection socket includes a metal housing with a ground connection portion directly contacting a ground-use pad electrode on the circuit substrate, eliminating the need for a ground pin and stabilizing the ground voltage, while signal pins are configured to maintain impedance matching with the coaxial line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If grounding is performed through contact between the ground pin outer circumferential surface and the metal housing inner wall surface, then the ground connection is achieved, but contact resistance generates impedance that destabilizes ground voltage
Solution Approach 1:
The invention extracts the ground connection function from the through-hole contact interface and relocates it to the lower surface of the metal housing. The ground connection portion is formed as a separate element on the lower surface that directly contacts the circuit substrate ground pad, eliminating the reliance on through-hole wall contact and its associated contact resistance.
Solution Approach 2:
The ground connection portion acts as an intermediary element between the metal housing and the circuit substrate ground pad. It provides a dedicated low-impedance ground path that mediates the connection, separating the ground function from the signal transmission path and reducing interference.
2Ease of operation
If the ground pin is held in a tilted state or unstable position, then insertion flexibility is maintained, but the ground connection becomes unstable leading to signal degradation
Solution Approach 1:
The invention segments the ground connection function from the signal pin structure. Instead of relying on the ground pin's positional stability, the ground connection is implemented as a separate ground connection portion on the metal housing lower surface, which remains stable regardless of pin positioning variations.
3Device complexity
If a ground pin structure is used for grounding the metal housing, then the existing grounding path is maintained, but the characteristic impedance of the signal path becomes unstable causing signal reflection
Solution Approach 1:
The invention extracts the ground connection function from the pin structure and implements it separately on the metal housing lower surface. This separation allows the signal path to maintain stable characteristic impedance without being affected by ground connection variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the ground voltage of the metal housing, suppressing signal degradation and interference during signal transmission between the IC package and the circuit substrate.
Implementation Method 1
a signal pin inserted into the first through hole to constitute a coaxial line together with an inner wall surface of the first through hole
Implementation Method 2
the ground connection portion being configured to come into contact with a ground-use second pad electrode formed on the circuit substrate and ground the metal housing
Data Source
AI summary
An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.


