Socket Holder Mounting Surface for LGA Contact Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LGA package socket technologies suffer from reduced positioning accuracy during the reflow process due to solder movement and sinking, affecting the accurate mounting of contacts on circuit boards.
Innovation Solution
A socket design featuring a housing with penetration holes, ribs, and holders that provide a stable mounting surface for contacts, ensuring accurate positioning and soldering, even when solder melts, by extending the holder's lower end outward to form a mounting surface on the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the contact is soldered to the circuit board using conventional methods, then the contact can be mounted on the circuit board, but the solder moves up and down and sinks when melted during reflow, deteriorating the positioning accuracy of the contact on the circuit board
Solution Approach 1:
The holder's lower end extends downward below the lower end of the housing in the vertical dimension, and is bent outward to form a mounting surface that protrudes beyond the housing's lower end. This dimensional extension provides a stable mounting reference that prevents solder-induced position shifts during reflow processing.
Solution Approach 2:
The holder acts as an intermediary component between the contact and the circuit board. It provides a stable mounting surface that mediates the connection, isolating the contact from the destabilizing effects of solder movement during reflow, thereby maintaining positioning accuracy.
2Manufacturing precision
If the holder's lower end is extended downward and bent outward to form a mounting surface, then positioning accuracy is improved, but the device complexity increases
Solution Approach 1:
The mounting surface is merged with the holder itself rather than being a separate component. The holder's lower end is directly bent outward to form the mounting surface, integrating the positioning function into the existing holder structure and avoiding additional complex components.
Solution Approach 2:
The holder's geometry is modified by changing its shape parameters - extending the lower end downward and bending it outward at a specific angle. This parameter change creates the mounting surface functionality without requiring a completely different structural design, thus limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures high positioning accuracy of contacts on the circuit board, preventing solder movement and sinking, thus enhancing the reliability of high-speed transmission connections.
Implementation Method 1
The elastic members apply outward urging force to the protruding pieces
Implementation Method 2
when the solder is melt by reflow
Data Source
AI summary
A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.