Socket Package With Integrated Capacitors and Spring Contacts
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Solution Overview
Problem
Existing socket packages face challenges in reducing complexity and cost during assembly, particularly in managing coefficient of thermal expansion (CTE) mismatches between processor packages and printed circuit boards (PCBs), and in routing capacitors around complex chip package layers.
Innovation Solution
A socket apparatus with a low-conductivity housing and spring contacts that absorb thermal expansion stresses, along with integrated capacitors to simplify connections and reduce assembly complexity by decoupling solder joints from housing stress and incorporating capacitors within the socket package to alleviate routing complexities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If socket packages use rigid housing structures to connect processor packages to PCBs, then mechanical connection stability is improved, but stress from CTE mismatches during temperature cycling increases
Solution Approach 1:
The patent employs spring contacts instead of rigid mechanical connections. The spring contacts can dynamically adjust their position and absorb stresses through elastic deformation, allowing the socket package to accommodate dimensional changes during temperature cycling while maintaining electrical connectivity. This dynamic approach replaces static rigid structures with movable compliant elements.
Solution Approach 2:
The patent changes the mechanical parameters of the connection system by using compliant spring contacts with specific elastic properties. The spring contacts have optimized stiffness and travel characteristics that allow them to absorb CTE-induced stresses while maintaining reliable electrical connection. This parameter optimization enables the system to tolerate thermal expansion differences between the processor package and PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress on solder joints, minimizes assembly complexity, and lowers costs by allowing spring contacts to move with thermal expansion, while integrating capacitors within the socket package simplifies connections and reduces chip package complexity.
Implementation Method 1
absorb stresses associated with coefficient of thermal expansion (CTE) mismatches between the package and the PCB during temperature cycling
Implementation Method 2
spring contacts each having a middle portion, a top end, and a bottom end... allow spring contacts to move with thermal expansion
Implementation Method 3
The assembly is heated causing the corresponding solder balls and pads to form solder joints thereby mechanically and electrically connecting the package and the PCB together
Data Source
AI summary
A socket package is provided to be positioned between a circuit package and a printed circuit board (PCB). The socket package includes a plurality of interconnects, to connect portions of the circuit package to portions of the PCB. Additionally, a plurality of capacitors are included with the socket package. The capacitors connect the interconnects provided to the socket package, and may be provided in lieu of capacitors in a circuit package, thus decreasing the complexity and build cost of the circuit package.