Socket with Integrated Flex Connector for High-Speed Signal Integrity
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Solution Overview
Problem
Existing electronic packaging technologies face limitations in connecting processor packages to PCBs or MLBs due to restrictive flex connectors and uneven clamping forces, which hinder high-speed signal transmission and increase signal loss.
Innovation Solution
Integration of a socket with a flex connector, featuring a dual-thickness design and a heat sink with adjustable force control assemblies, allowing for efficient electrical communication and reduced signal loss by enabling better contact registration and load management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separate flex connector is used to connect the processor package with other board components, then electrical connections can be established, but the flex connector extends laterally from the processor package, restricting the number of connections that can be made for any particular footprint
Solution Approach 1:
The patent combines the socket and flex connector into a single integrated component. The socket body directly incorporates the flex connector, eliminating the need for separate lateral extensions. This integration allows multiple electrical connections to be made within a compact footprint, as the flex connector is positioned between the socket body and the processor package rather than extending outward, thereby increasing connection density without expanding the overall footprint.
2Stability of the object's composition
If a pair of screws are used to mount the processor package to an MLB via a processor socket, then the processor package can be secured, but the screws can unevenly distribute the clamping forces
Solution Approach 1:
The integrated socket-f flex connector assembly is designed to distribute clamping forces evenly through its structure. The socket body with its specific thickness configuration (first portion with greater thickness than the second portion) naturally distributes the mounting forces across multiple contact points with the MLB, eliminating the need for separate screws that create uneven force distribution. The assembly essentially serves itself by incorporating the mounting function into the socket structure rather than requiring external fastening elements.
3Loss of energy
If high-speed signals are transmitted through the MLB, then electrical connections can be made, but signal loss increases
Solution Approach 1:
The patent extracts high-speed signal transmission paths from the MLB substrate and routes them directly through the integrated socket and flex connector assembly. By taking out the signal path from the lossy MLB environment and providing dedicated transmission paths through the socket structure, signal loss is reduced while maintaining signal integrity. The flex connector positioned between the socket and processor package provides direct electrical pathways that bypass the MLB's signal routing, thereby reducing electromagnetic interference and signal degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances signal integrity and reduces power loss by allowing high-speed signals to bypass the MLB, providing a higher density of connections and improved contact registration, while the adjustable force control ensures stable and efficient heat dissipation.
Implementation Method 1
a heat sink may be positioned on a side of the socket opposite the MLB
Implementation Method 2
the variable force generating member may include a coil spring
Data Source
AI summary
The connector portion of a flex connector may be integrated into a socket, by forming a complete cutout in the socket in which the connector is located, or by forming the socket with a portion having a reduced thickness relative to the rest of the socket, with the connector being positioned in this portion of reduced thickness between the socket and an MLB. Another flex connector may be formed vertically above the first flex connector, mounted to the top surface of the package and clamped in place by a heat sink on top of the stack. Providing both top and bottom flex connectors may multiply the number of available connections for a given footprint. A heatsink positioned on top of the stack may include a spring assembly on a bottom portion to engage specified portions of the stack with a predefined force to ensure correct loading.