Socket Interposer Pin Pitch Redesign for High Density

The patent introduces a socket as an intermediary component between the system board and the package. The socket contains an interposer with two different pitch interfaces: a first pitch interface that connects to the system board with larger spacing, and a second pitch interface that connects to the package with smaller spacing. This intermediary structure allows the system board to maintain larger, easier-to-manufacture pin spacing while still supporting high pin counts through the socket's density multiplication capability.

The patent adds a vertical dimension to the connection architecture by introducing the socket as a separate layer between the system board and package. Instead of directly reducing the system board pin pitch in the horizontal plane, the solution stacks the connection interfaces vertically, with the interposer providing pitch translation from the first pitch interface to the second pitch interface across different layers.

The socket with its interposer serves as a mediator that absorbs the pitch translation requirement. The package can maintain its native pin spacing without modification, while the interposer provides the necessary pitch adaptation to match the system board requirements. This eliminates the need to increase package size to maintain pin spacing precision.

The patent changes the pitch parameter at the socket interface rather than at the package interface. The interposer is designed with a first pitch interface that matches the system board's larger spacing requirements and a second pitch interface that matches the package's smaller spacing. This parameter transformation occurs at the socket level, allowing the package to maintain optimal dimensions.

The patent resolves the manufacturability issue by stacking pitch interfaces vertically rather than compressing them horizontally. The interposer provides a first pitch interface at one vertical level and a second pitch interface at another vertical level, allowing each interface to be manufactured at its optimal pitch using existing technology. The pitch reduction is achieved through vertical stacking and pitch translation rather than horizontal compression.

The patent segments the pitch translation function into a separate interposer component within the socket. Rather than requiring the entire socket to be manufactured with high-density pitch, only the interposer needs to accommodate the pitch transition. This segmentation allows the majority of the socket structure to be manufactured with standard technologies while the interposer handles the pitch adaptation.