Socket Latch Mechanism Reducing Operating Force and Size
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Solution Overview
Problem
Conventional socket designs for semiconductor packages, such as BGA, are large and require high operating forces, and can scratch the semiconductor package due to the rotational travel of the latch member, which increases the outer dimension of the socket.
Innovation Solution
A socket design with a reduced size and operating force, featuring a latch mechanism that includes a link member, latch member, and lever member, where the link member connects the cover member to the latch member, and the lever member uses the principle of leverage to reduce the operating force, and a latch plate is used to prevent scratching of the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional latch mechanism is used to press the semiconductor package, then the package can be held securely, but the socket outer dimension increases and the package surface may be scratched due to rotational travel of the latch member
Solution Approach 1:
The latch mechanism is divided into separate functional components: the latch member for engagement, the lever member for force amplification, and the pressing member for applying downward force. This segmentation allows each component to be optimized for its specific function while reducing the overall socket dimension.
Solution Approach 2:
The pressing member acts as an intermediary between the latch mechanism and the semiconductor package. It transfers the pressing force from the latch member to the package without requiring direct contact, thereby preventing surface scratches while maintaining secure holding.
2Device complexity
If a conventional latch mechanism with direct contact is used, then the structure is simple, but the semiconductor package surface is scratched due to rotational travel of the latch member
Solution Approach 1:
The pressing member serves as an intermediary element that contacts the semiconductor package instead of the latch member. This mediator transfers the necessary pressing force while preventing direct rotational contact between the latch member and the package surface, thereby eliminating scratching.
Solution Approach 2:
The harmful rotational contact function is extracted from the latch member by introducing a separate pressing member. The latch member's rotational motion is decoupled from direct package contact, isolating the harmful effect from the package surface.
3Volume of stationary object
If a conventional latch mechanism is used, then the structure is compact, but high operating force is required to press the semiconductor package
Solution Approach 1:
The lever member introduces dynamic mechanical advantage to the latch mechanism. By utilizing the lever's rotational motion around a fulcrum, a small input force on the latch member is amplified into a larger output force on the pressing member, reducing the required operating force while maintaining compact dimensions.
Solution Approach 2:
The lever member changes the force parameter through mechanical advantage. The ratio of lever arm lengths transforms the input force magnitude, allowing compact socket dimensions to coexist with reduced operating force requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a smaller socket size and reduced operating force while preventing scratching of the semiconductor package, allowing for finer contact pitches and efficient semiconductor package mounting and removal.
Implementation Method 1
the lever member uses the principle of leverage to reduce the operating force
Implementation Method 2
A coil spring 32 is wound around the post 31 so that the cover member 30 is continuously energized in a direction to be separated from the base member 20
Data Source
Figure 1(A)~1(C)
Figure 2
Figure 3(A)~3(B)
AI summary
Problem(s): The present invention is intended to reduce the side of a socket with a latch mechanism different from a conventional art. Means to Solve the Problem(s): A socket 100 according to the present invention comprises a base member 200 for holding a plurality of contacts, a cover member 300, and a latch mechanism for pressing a semiconductor package. The latch mechanism comprises a latch member 600 having a pressing portion, a link member 500 connected to the cover member 300 at a first end and with the pressing portion 620 of the latch member 600 at a second end, a lever member 700 rotatably fixed to the base member 200 and connected with the cover member 300 at a first end and with a narrow portion 630 of the cover member 300 at a second end. The link member 500 and the lever member 700 causes the pressing portion 620 of the latch member 600 to move to an evacuated position when the cover member 300 moves in a direction to be close to the base member 200, while the link member 500 and the lever member 700 cause the pressing portion 620 of the latch member 600 to move to a position where an electronic device can be pressed when the cover member moves in a direction to be separated from the base member 200.