Socket Latch Plate Uniform Pressure Distribution
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Solution Overview
Problem
Conventional sockets for semiconductor devices, particularly those with large-sized and thin IC chips, face challenges in distributing reaction forces evenly, leading to potential deformation and scratches during the burn-in test, as they often apply pressure only on specific points rather than the entire surface of the chip.
Innovation Solution
A socket design featuring a base member, a reciprocally movable cover member, elastically deformable contacts, and a novel latch plate mechanism that allows vertical movement and expanded pressing area, enabling uniform pressure distribution across the entire surface of the IC package, thereby reducing deformation and scratches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sockets apply pressure on specific points only, then the structure is simple, but the IC package experiences deformation and scratches due to uneven pressure distribution
Solution Approach 1:
The latch plate is designed to extend in the width direction beyond the sidewalls, transitioning from a narrow contact point to a broad surface contact. This dimensional expansion allows the pressing portion to distribute reaction forces across the entire IC package surface, preventing deformation and scratches while maintaining structural feasibility
2Force
If the latch plate is restricted to vertical movement only, then the pressing force is concentrated, but the pressing area is limited causing uneven force distribution
Solution Approach 1:
The latch plate is configured to move not only vertically but also rotate about axis members, adding a rotational dimension to the movement. This enables the pressing portion to contact and distribute force across a broader area of the IC package, transforming concentrated force into distributed pressure
3Reliability
If the latch member presses the IC package directly, then the mechanism is simple, but large and thin IC packages are deformed due to localized pressure
Solution Approach 1:
The latch plate serves as an intermediary between the latch member and the IC package. It translates the localized pressing action of the latch member into distributed pressure across the entire IC package surface, protecting large and thin packages from deformation while adding necessary functional complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces scratches and deformation risks for both large and thin IC packages by ensuring even pressure distribution across the entire surface, enhancing the reliability of the burn-in test process.
Implementation Method 1
a latch plate rotatably attached with the mounting member and urged at a first direction by an elastic member
Implementation Method 2
each contact fixed with the base member and having an elastically deformable portion between first and second ends
Data Source
AI summary
A socket (100) of the present invention includes a base member (20), a cover member (30), a plurality of contacts (40), a latch member (60A) that is rotatably supported by the base member (20) and rotates in response to movement of the cover member (30), an adaptor (50) providing a mounting surface for an IC package and attached with the base member (20) so as to move in an up and down direction in response to the movement of the cover member (30), and a latch plate (200) rotatably attached with the adaptor (50A) and urged by an elastic member. The adaptor (50A) is formed with a latch guide (58) that moves the latch plate (200) in the vertical direction when the latch plate (200) presses the IC package.