Semiconductor Burn-In Socket Latch Plate Scratch Prevention
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Solution Overview
Problem
Conventional sockets for semiconductor devices like BGA and LGA risk scratching the top surface during the burn-in test due to the horizontal movement of the latch member, leading to rejection and shipping issues.
Innovation Solution
A socket design featuring a latch member with an elastically deformable portion and a latch plate that moves vertically, guided by a plate guide, to prevent scratches by ensuring the latch plate presses the semiconductor device in a vertical direction, reducing the risk of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the latch member rotates to press the semiconductor device, then the device is securely held, but the top surface of the device may be scratched
Solution Approach 1:
The latch member is divided into two functional parts: the main latch member body that rotates to provide holding force, and a separate latch plate that makes contact with the device surface. This segmentation allows the rotating latch member to apply pressure through the non-rotating latch plate, preventing direct rotational contact and surface scratches while maintaining secure holding.
Solution Approach 2:
The latch plate acts as an intermediary between the rotating latch member and the semiconductor device. It transfers the pressing force from the latch member to the device without being subjected to rotational motion itself, thereby preventing surface damage while ensuring reliable device holding during the burn-in test.
2Ease of operation
If the latch member presses the device during attachment, then the device is securely mounted, but the horizontal movement of the latch member may cause surface damage
Solution Approach 1:
By separating the pressing function (latch plate) from the rotational actuation function (latch member), the design enables secure device mounting through vertical pressing while eliminating the horizontal movement that causes surface scratches during the attachment process.
3Device complexity
If a simple latch mechanism is used, then the device structure is simple, but the device may be damaged due to horizontal pressing movement
Solution Approach 1:
The addition of the latch plate as a separate component increases structural complexity slightly, but this minimal increase prevents device damage by eliminating horizontal pressing movement, thereby significantly improving device integrity and reducing rejection rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The socket effectively protects the top surface of semiconductor devices from scratches, enhancing the yield by preventing damage during attachment and detachment, and ensuring secure electrical connections.
Implementation Method 1
each contact having a elastically deformable portion between both ends
Data Source
AI summary
Provided is a socket which protects an upper surface of a semiconductor device from being scratched due to contact, by using a latch plate. A socket (10) includes a base member (20), a cover member (30) that reciprocates in a direction to be close to or separated from the base member (20), a plurality of contacts (40), an adaptor (50) that moves in a direction to be close to or separated from the base member and provides a surface for placing a semiconductor package, a latch member (60) that rotationally shifts with reciprocation of the cover member (30), and a latch plate (70) connected to the latch member (60). The latch plate (70) prevents the leading edge of the latch member (60) from being directly brought into contact with a Ball Grid Array (BGA), and presses down the BGA placed on the adaptor (50) in the vertical direction.