Semiconductor Socket Leverage Mechanism Reduces Operating Force
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Solution Overview
Problem
The existing semiconductor device sockets require a significant operating force to mount and detach semiconductor devices, which becomes impractical with an increasing number of contact pins, and there is a need to reduce this force without increasing the socket's size to accommodate high-density IC socket arrangements on printed circuit boards.
Innovation Solution
The semiconductor device socket design incorporates a pressing member supported by a movable support body and a lever member with a driving mechanism, allowing the pressing member to be moved parallel to the semiconductor device's surface, reducing the required operating force through the principle of leverage, while maintaining the socket's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of contact pins is increased to accommodate more electrodes, then the electrical connection capability is improved, but the operating force required to press the pressing member increases significantly
Solution Approach 1:
The pressing member is divided into multiple pressing portions, each corresponding to a group of contact pins. This segmentation allows the total pressing force to be distributed across multiple localized contact points, reducing the force required at each individual point while maintaining overall electrical connection capability.
Solution Approach 2:
The pressing member is designed to press in a direction substantially parallel to the surface of the semiconductor device rather than perpendicular to it. This dimensional change in pressing direction reduces the mechanical force required by utilizing the leverage principle through the lever member, while still achieving effective electrical contact through the distributed pressing portions.
2Force
If the distance between fulcrum and contact point is reduced to decrease operating force, then the operating force is reduced, but the socket body size increases
Solution Approach 1:
The pressing member is configured to move dynamically in a direction substantially parallel to the semiconductor device surface during pressing operation. This dynamic movement direction, combined with the lever member's rotational motion, achieves force reduction through leverage without requiring a larger socket body, as the pressing action occurs within the existing spatial constraints.
3Reliability
If the pressing member presses perpendicular to the semiconductor device surface, then the contact reliability is improved, but the operating force required increases
Solution Approach 1:
The pressing direction is changed from perpendicular to substantially parallel with the semiconductor device surface. This dimensional change in pressing orientation reduces the required operating force by utilizing the lever member's mechanical advantage, while the distributed pressing portions ensure reliable electrical contact is maintained across all contact pins.
Solution Approach 2:
The pressing member is segmented into multiple pressing portions that distribute the contact force across multiple contact points. This segmentation maintains contact reliability by ensuring each contact pin receives adequate pressing force, while the overall operating force is reduced due to the parallel pressing direction and lever mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the pressure operating force needed for mounting and detaching semiconductor devices, ensuring efficient high-density IC socket arrangements on printed circuit boards without increasing the socket's size.
Implementation Method 1
the lever member with the intermediate section to be rotational movably supported by the pressing member support body, having one end connected to the pressing member and being configured to move the pressing member with respect to the pressing member support body
Data Source
AI summary
A semiconductor device socket including lever members connected to a pressing member movably supported by a pressing member support body. The lever members are operated in conjunction with rotation of an engaging pin of an operating lever supported by a common support shaft with the pressing member support body.