Socket Structure Thermal Management via Metallic Frame
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Solution Overview
Problem
Power sockets with USB ports often experience local overheating due to component size and arrangement limitations, restricting the increase in carried wattage and potentially leading to component damage.
Innovation Solution
A socket structure combining a metallic frame and casing enhances thermal conductivity by conducting heat to the exterior, using a metallic frame with extending portions and a heat conducting component to improve heat dissipation, thereby addressing local overheating and enabling higher power handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If USB ports are added to power sockets to meet market requirements for charging, then the functionality and market competitiveness are improved, but local overheating occurs due to component arrangement limitations
Solution Approach 1:
The power socket is divided into multiple independent cavity modules, each housing specific components. This segmentation allows heat to be distributed across multiple smaller areas rather than concentrated in one location, reducing local overheating while maintaining USB charging functionality.
Solution Approach 2:
A metal frame structure is introduced as an intermediary thermal conduction path between the internal components (USB ports, circuitry) and the external environment. The metal frame acts as a heat sink and thermal highway, efficiently transferring heat away from sensitive components to prevent overheating.
2Power
If the total wattage of power sockets is increased to meet rising power requirements, then the power delivery capability is improved, but overheating and component damage risk increase
Solution Approach 1:
The metal frame serves as a thermal intermediary that intercepts heat generated by high-power components before it can damage them. This allows the socket to safely handle higher wattages by providing a dedicated heat evacuation pathway.
Solution Approach 2:
Different regions of the socket are designed with different thermal properties - high-heat areas near USB ports and high-wattage components are strategically positioned adjacent to metal frame structures that provide superior thermal conduction, while other areas use different materials optimized for their specific functions.
3Adaptability or versatility
If more components are arranged in limited space to increase functionality, then the charging capability is improved, but heat dissipation becomes insufficient
Solution Approach 1:
Multiple USB ports and charging components are segmented into separate cavities, each with its own thermal management approach. This prevents heat accumulation in a single concentrated area and allows each component to dissipate heat more effectively.
Solution Approach 2:
The metal frame extends heat dissipation from the two-dimensional component layout into the third dimension by providing vertical thermal conduction paths through the socket structure, allowing heat to escape in multiple directions rather than being trapped in the planar component arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation effectively reduces local overheating, allowing for increased wattage capacity and meeting market demands for higher power delivery while simplifying installation and reducing assembly costs.
Implementation Method 1
the thermal conductivity of the socket structure is improved. As a result, the heat inside the socket structure can be efficiently conducted to the exterior of the socket structure
Data Source
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AI summary
The present disclosure provides a socket structure including a casing (1), a main body (2), a frame (3) and a cover (4). The casing (1) includes plural lateral walls (11), a bottom (12), an opening (13) and an accommodation space (14). The opening (13) is defined by the lateral walls (11). The accommodation space (14) is defined by the lateral walls (11) and the bottom (12) and is in communication with the opening (13). The main body (2) is disposed in the accommodation space (14) and includes a circuit board (21) and a connection port (22) disposed on the circuit board (21). The frame (3) includes at least one plate (31) and a first extending portion (32). The plate (31) surrounds the periphery of the opening (13). The first extending portion (32) is extended from the plate (31) and is connected to one of the lateral walls (11). The cover (4) covers the opening (13) and includes a through hole (41). The through hole (41) is configured to allow a plug to pass through and connect to the connection port (22).