Socket Mislay Detection in Electronic Device Testing
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Solution Overview
Problem
Existing electronic device testing apparatuses face issues with 'double placing' of IC devices on sockets, leading to erroneous test results and potential damage due to incomplete removal of previous devices, which cannot be fully mitigated by human oversight alone.
Innovation Solution
An electronic device testing apparatus equipped with an image pickup portion to capture images of sockets, a memory to store reference images, and a mislay determination portion to compare actual and reference images, automatically detecting if IC devices remain on the sockets, with an optional alarm to alert operators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automatic suction and pressing operations are performed continuously, then productivity is improved, but the risk of IC devices remaining on sockets increases
Solution Approach 1:
The system performs a preliminary image capture and comparison operation before the suction/pressing action to detect and prevent IC devices that remain on sockets. This advance detection ensures that only clean sockets are used for testing, preventing the harmful effect of residual devices while maintaining continuous operation.
Solution Approach 2:
The system captures an image of the socket after the suction/pressing operation, compares it with the reference image, and uses the result as feedback to determine whether the operation was successful. This feedback mechanism allows the system to detect and correct placement errors automatically, ensuring reliability while maintaining productivity.
2Measurement precision
If manual inspection is used to detect remaining IC devices, then detection accuracy is improved, but productivity decreases
Solution Approach 1:
The system creates a digital copy (image) of the socket state after the operation and compares it with a reference copy. This copying method provides accurate detection of remaining IC devices while being much faster and more suitable for automated high-speed operation than manual inspection, thus maintaining both accuracy and productivity.
3Speed
If IC devices are pressed against sockets without verification, then operation speed is improved, but the risk of double placing and erroneous test results increases
Solution Approach 1:
The system performs image capture and comparison as a feedback verification step after the pressing operation. This feedback mechanism confirms that the IC device was successfully placed and tested, preventing double placing and erroneous results while allowing the system to operate at high speed through automated verification.
Solution Approach 2:
The system replaces manual visual inspection with an automated optical detection system (image pickup and comparison). This substitution maintains high operation speed while ensuring precise verification of device placement and test result accuracy through digital image processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables automatic detection and prevention of 'double placing,' improving test accuracy and reducing the risk of damage to both IC devices and sockets by ensuring complete removal, thereby enhancing operational efficiency and reliability.
Implementation Method 1
an image pickup portion that takes an image of the sockets
Data Source
AI summary
An electronic device testing apparatus for conveying electronic devices to be tested to sockets of a contact portion and bringing the electronic devices to be tested electrically contact with the sockets to conduct a test of electric characteristics of the electronic devices to be tested, comprising an image pickup portion that takes an image of the sockets; a memory portion that stores reference image data of the sockets in a state of not being attached with any electronic devices to be tested obtained by taking images by the image pickup portion; and a mislay determination portion that obtains check image data of the sockets from the image pickup portion, reads the reference image data from the memory portion, compares the check image data with the reference image data and determines whether any of the electronic devices to be tested remain on the sockets.