Socket Mounting for Parallel Optical Modules on PCBs

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Solution Overview

Problem

The existing methods for mid-plane mounting of parallel optical communications modules on circuit boards require drilling holes and manual installation of fastening devices, which are time-consuming and not suitable for automation, and prevent electrical conductors from being routed through these holes.

Innovation Solution

A socket configuration with lugs that are soldered to solder pads on the host circuit board, eliminating the need for drilling holes and allowing for automated securement of the module, using a solder reflow process for secure attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If holes are drilled and fastening devices are manually installed to secure the socket to the host PCB, then the module is securely attached and mechanical shocks and vibrations are reduced, but the process is time-consuming and not suitable for automation

Engineering Contradiction:

Improvesecure attachment of moduleVSAvoidmounting process efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces the manual mechanical fastening system (drilling holes and installing fastening devices) with an automated soldering system. The socket is secured to the host PCB through solder joints formed by automated soldering processes, eliminating the need for manual drilling and fastener installation while maintaining secure attachment and reducing mechanical shocks and vibrations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Strength

If holes are drilled through the host PCB to secure the socket, then the socket is firmly attached to the PCB, but electrical conductors cannot be routed through the drilled holes

Engineering Contradiction:

Improveattachment strength of socket to PCBVSAvoidPCB conductor routing flexibility

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent replaces the hole-drilling mechanical attachment method with a surface-mount soldering approach. The socket is attached to the PCB surface through solder joints formed on the PCB surface, eliminating the need for through-holes and allowing electrical conductors to be routed freely through the PCB without obstruction.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If manual fastening devices are used to secure the socket, then the module is firmly mounted, but the process requires manual installation which reduces productivity

Engineering Contradiction:

Improvefirm mounting of moduleVSAvoidmanual installation time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces manual mechanical fastening with automated soldering processes. The socket is secured to the host PCB through solder joints that are formed by automated soldering equipment, eliminating manual installation steps and significantly reducing assembly time while maintaining firm mounting and reliability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Object-affected harmful factors

If drilling and manual fastening are used to secure the socket, then mechanical shocks and vibrations are reduced, but the process is complex and time-consuming

Engineering Contradiction:

Improvemechanical shocks and vibrationsVSAvoidmounting process complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent replaces the complex multi-step mechanical fastening process (drilling, inserting fasteners, tightening) with a simpler automated soldering process. The socket is secured through solder joints formed on the PCB surface, reducing process complexity and assembly steps while still providing secure attachment that reduces mechanical shocks and vibrations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables secure and automated attachment of parallel optical communications modules to circuit boards without manual installation of fastening devices, reducing mechanical shocks and vibrations, and allowing for more efficient PCB design by eliminating the need for hole drilling.

Implementation Method 1

The socket is secured to the host PCB with an array of solder joints

Methodology Applied

Scientific EffectSoldering: Soldering

Data Source

PatentUS9106027B2Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards

Publication Date: 2015.08.11 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD

AI summary

A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB.