Socket Nested Frame Support for Circuit Board Warpage
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Solution Overview
Problem
Conventional socket designs for integrated circuit packages lack centralized support, leading to moments and warping issues due to heatsink clamping forces, particularly affecting organic substrates, which can result in thermal conductivity drops and temperature spiking, and also suffer from warpage after solder reflow, complicating ohmic contact and structural support.
Innovation Solution
A socket design featuring a support structure with nested frames that projects away from the floor to provide enhanced support to the circuit board, including a socket cover and housing with cavities and support structures to accommodate the central portion of the chip package and mitigate warpage after solder reflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a conventional socket design with narrow walls and corners is used, then the socket structure is simple, but the integrated circuit package lacks centralized support leading to moments and warping under heatsink clamping forces
Solution Approach 1:
The patent introduces a support structure that projects upward from the socket floor into the third dimension, creating a centralized support pillar. This vertical dimension addition provides direct support to the central portion of the integrated circuit package, preventing moments and warping under heatsink clamping forces while maintaining relative simplicity in the horizontal plane.
2Ease of manufacture
If an organic substrate is used for the integrated circuit package, then the package is more flexible and easier to manufacture, but it cannot resist the moments associated with heatsink clamping force causing excessive flexure and warping
Solution Approach 1:
The patent introduces a support structure as an intermediary element between the socket and the integrated circuit package. This support structure acts as a mediator that provides the necessary mechanical strength to resist moments from heatsink clamping forces, allowing the use of flexible organic substrates without compromising structural integrity.
3Force
If the central portion of the organic substrate undergoes excessive flexure, then the substrate can accommodate the heatsink clamping force, but the thermal interface material stretches leading to increased spacing between aluminum spheres and reduced thermal conductivity
Solution Approach 1:
The patent applies preliminary anti-action by providing a support structure that prevents excessive flexure of the organic substrate before it can occur. The support structure counteracts the bending moments from heatsink clamping forces in advance, maintaining the integrity of the thermal interface material and preventing stretching that would reduce thermal conductivity.
4Ease of manufacture
If the socket housing warps upward after solder reflow, then the solder connections are established, but the warpage complicates ohmic contact and requires conductor pins to be longer
Solution Approach 1:
The patent applies local quality by providing support at specific critical locations within the socket housing. The support structure is positioned to maintain local planarity in areas critical for ohmic contact, while allowing other areas to warp naturally after solder reflow. This localized support ensures proper alignment without requiring longer conductor pins.
Data Source
AI summary
Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames. In another aspect, a socket with a with socket cover coupled to a socket housing is disclosed. The socket housing includes a support structure to support a portion of the socket cover.