Socket Plug Interconnection for Flexible Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor packages lack flexibility and effective interconnection structures that maintain electrical connectivity even when the semiconductor chips or substrates are bent or warped, limiting their integration density and adaptability in portable and wearable electronics.
Innovation Solution
The semiconductor package incorporates socket bumps on a first substrate and plug bumps on a second substrate, with the socket bumps forming insertion grooves that allow the plug bumps to insert and move reciprocally, maintaining electrical connection despite substrate bending, using retractile conductive connection members like elastic springs or conductive nano wires for enhanced contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional rigid interconnection structures are used, then manufacturing precision is improved, but flexibility and adaptability to bending are worsened
Solution Approach 1:
The interconnection structure transitions from a static rigid connection to a dynamic system where plug bumps can move reciprocally within socket bumps along insertion grooves. This dynamic capability allows the structure to adapt to substrate bending while maintaining electrical connectivity, resolving the contradiction between manufacturing precision and flexibility.
Solution Approach 2:
The patent employs thin-film conductive materials and flexible interconnection geometries that can deform with substrate bending. The insertion groove structure combined with reciprocating plug bumps creates a flexible yet precise interconnection system that maintains electrical contact under mechanical stress.
2Adaptability or versatility
If socket plug interconnection structures with reciprocating motion are implemented, then flexibility is improved, but device complexity increases
Solution Approach 1:
The interconnection system is segmented into discrete socket bumps with insertion grooves and corresponding plug bumps. Each unit operates independently with reciprocating motion capability, allowing the complex flexible interconnection function to be distributed across multiple simple modular elements rather than requiring a single complex mechanism.
Solution Approach 2:
The plug bumps automatically maintain electrical connection through their own reciprocating motion within the insertion grooves. The structure self-adjusts to substrate deformation without requiring external control mechanisms, reducing overall system complexity while maintaining flexibility.
3Productivity
If integration density is increased, then productivity is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent utilizes three-dimensional vertical stacking with bump-based interconnections that extend in the Z-dimension. This vertical arrangement allows high integration density on the substrate surface while the protruding socket and plug bumps provide thermal pathways in the vertical direction, enabling heat dissipation without compromising integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables flexible semiconductor packages that maintain electrical connectivity and adapt to substrate bending, enhancing integration density and compatibility with flexible electronic systems while ensuring reliable signal transmission.
Implementation Method 1
plug bumps configured to move in the insertion grooves with a reciprocating motion
Implementation Method 2
plug bumps may be electrically connected to the socket bumps, respectively
Data Source
AI summary
A semiconductor package may include a first substrate and a second substrate. Socket bumps may be disposed on the first substrate to provide insertion grooves within the socket bumps. Plug bumps may be disposed on the second substrate. The plug bumps may be configured for insertion into the insertion grooves of the socket bumps and may electrically connect to the socket bumps. Related memory cards and electronic systems may also be provided.