Socket Connector Protrusions for IC Package Positioning

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Solution Overview

Problem

Existing socket connectors face challenges in maintaining precise positioning of IC packages due to deformation of protrusions caused by shrinkage and high-temperature environments, which affects the accuracy of IC package alignment with contact terminals and conductive pads.

Innovation Solution

The socket connector design features protrusions that are discretely distributed and formed separately from the sidewalls, allowing them to remain intact and undeformed during high-temperature processes, ensuring accurate positioning of the IC package by being physically away from the sidewalls.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If protrusions are integrally formed with sidewalls to position IC package, then positioning function is provided, but accuracy is influenced by deformation of sidewalls caused by high-temperature environment

Engineering Contradiction:
Improvepositioning accuracyVSAvoiddeformation of protrusions
Core Design Contradiction:
Measurement precisionVSStability of the object's composition

Solution Approach 1:

The protrusions are formed as separate components from the sidewalls, creating independent positioning elements. This segmentation allows the protrusions to maintain their dimensional stability while the sidewalls may deform under high-temperature conditions, thereby preserving positioning accuracy despite thermal exposure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The positioning function is extracted from the sidewalls and embodied in separate protrusion components. By taking out the positioning function from the thermally susceptible sidewalls and placing it in dedicated protrusions, the design isolates the critical positioning function from thermal deformation effects.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If protrusions are formed separately from sidewalls, then deformation is prevented under high temperature, but manufacturing complexity increases

Engineering Contradiction:
Improveintegrity of protrusionsVSAvoidstructure of socket connector
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The separate protrusions are integrated with the socket body through appropriate joining methods, merging the positioning function into the overall structure while maintaining the dimensional independence of the protrusions. This combination approach achieves reliability without excessive complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If sidewalls are made noncontinuous and short to reduce deformation, then influence on protrusion accuracy is reduced, but structural strength decreases

Engineering Contradiction:
Improvepositioning accuracyVSAvoidstrength of sidewalls
Core Design Contradiction:
Measurement precisionVSStrength

Solution Approach 1:

The sidewalls are segmented with gaps to reduce thermal stress accumulation and deformation, while the separate protrusions provide the necessary positioning function. This segmentation allows the sidewalls to be shorter and less continuous without compromising overall structural integrity, as the protrusions carry the positioning load.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS7887356B1Socket connector having protursions for positioning IC package
Publication Date: 2011.02.15 HON HAI PRECISION INDUSTRY CO LTD
  • US7887356B1 patent drawing
  • US7887356B1 patent drawing
  • US7887356B1 patent drawing

AI summary

A socket connector includes a socket body, a plurality of contact terminals received in the socket body. The socket body includes an upper surface, a plurality of sidewalls extending upwardly from the upper surface. The upper surface and the sidewalls jointly define a cavity for receiving an IC package therein. A plurality of protrusions extend upwardly from the upper surface and formed separately from the sidewall. The protrusions being discretely distributed at periphery of the IC package and thereby positioning the IC package.