Socket With Routed Contacts Resolving PCB Trace Congestion
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Solution Overview
Problem
High pin-count integrated circuits require high-density electrical traces on printed circuit boards, leading to trace congestion, increased costs, and signal integrity issues, particularly when routing signals across multiple layers.
Innovation Solution
A socket with an interposer that routes signals between the integrated circuit and the printed circuit board, reducing the need for multiple layers by allowing horizontal routing and external signal routing via flex connectors, and incorporating auxiliary chips for configuration and management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If high-density electrical traces are used on PCB to support high pin-count integrated circuits, then the integrated circuit can be properly interfaced, but trace congestion increases and signal integrity deteriorates
Solution Approach 1:
The patent introduces a socket interposer that adds a new dimensional layer between the integrated circuit and PCB. This interposer provides additional routing dimensions (horizontal routing on interposer surfaces) beyond the traditional vertical PCB layer structure, allowing signals to be routed in multiple dimensions and reducing congestion in any single plane.
Solution Approach 2:
The socket interposer acts as an intermediary component between the integrated circuit and the PCB. It mediates the connection by providing its own routing infrastructure, thereby reducing the burden on PCB trace routing and improving signal integrity by separating the high-density IC interface from the PCB trace congestion.
2Adaptability or versatility
If multiple PCB layers are used to route traces crossing under the integrated circuit and socket, then signal routing is enabled, but PCB cost and design time increase
Solution Approach 1:
The interposer provides horizontal routing surfaces that eliminate the need for vertical trace routing under the IC and socket. By moving routing to the horizontal plane on the interposer, the patent reduces the number of PCB layers required for signal crossing.
Solution Approach 2:
The patent extracts the routing function from the PCB and relocates it to the socket interposer. This separation allows the PCB to focus on external connections while the interposer handles internal signal routing, thereby reducing PCB complexity.
3Adaptability or versatility
If high trace congestion is present in the PCB around the processor socket, then high pin-count interfaces are supported, but overall system size and cost increase
Solution Approach 1:
The interposer creates additional routing dimensions that distribute traces horizontally rather than concentrating them vertically in the PCB. This dimensional redistribution reduces the area required for trace routing around the socket.
Solution Approach 2:
The interposer mediates the high pin-count interface requirements by providing its own routing infrastructure, thereby preventing the need for expanded PCB area to accommodate trace routing for high pin-count ICs.
Data Source
AI summary
A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136′) that the conductive network routes horizontally in or on the substrate (310).