Socket Side Thermal Sensing for IC Testing
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Solution Overview
Problem
Current thermal control methods for integrated circuit (IC) device testing face challenges such as significant errors due to non-standard thermal paths and varying thermal resistance, especially when power dissipation occurs near the socket side, and existing temperature sensing techniques are limited by access constraints and interference with thermal control mechanisms.
Innovation Solution
The implementation of a socket side thermal sensing system using conductive traces or flexible circuit boards with temperature-dependent characteristics, allowing for real-time temperature measurement and control on the socket side of the IC device, which reduces interference with electrical contacts and enhances thermal control accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are placed on the second side of the DUT (opposite the socket side), then temperature measurement is possible, but measurement precision deteriorates when power dissipation occurs near the socket side due to non-standard thermal paths and varying thermal resistance
Solution Approach 1:
The patent inverts the conventional temperature sensing approach by placing sensors on the socket side of the DUT instead of the traditional second side. This inversion allows direct measurement of temperature at the location where power dissipation occurs, eliminating errors caused by non-standard thermal paths and varying thermal resistance that affect second-side sensing. The socket side sensors directly capture the thermal conditions at the heat generation source.
Solution Approach 2:
The patent introduces conductive traces as intermediary elements that serve dual purposes: electrical connectivity and temperature sensing. These traces are strategically placed on the socket side and extend along the DUT surface, acting as thermal conduits that transfer temperature information from power dissipation regions to sensing points. The traces mediate between the heat sources and measurement points, enabling accurate temperature measurement without direct sensor contact with the DUT.
2Ease of operation
If standard temperature sensors are used on the second side of the DUT, then temperature sensing is achieved, but device complexity increases due to limited access and interference with thermal control mechanisms
Solution Approach 1:
The patent implements multi-functionality by designing conductive traces that simultaneously serve electrical connectivity and temperature sensing functions. These traces are already present in the socket structure for electrical purposes, and the patent repurposes them as thermal sensing elements. This eliminates the need for separate sensor installations on the DUT, reducing overall system complexity while maintaining sensing capability.
Solution Approach 2:
The conductive traces perform self-service by utilizing their inherent thermal conductivity to provide temperature sensing without requiring additional sensors or complex installation procedures. The existing electrical traces automatically serve as temperature sensors due to their thermal properties, eliminating the need for separate sensing infrastructure and simplifying the overall thermal control system.
3Measurement precision
If temperature sensors are placed near electrical contacts on the socket side, then temperature measurement accuracy improves, but electrical contact performance deteriorates due to interference
Solution Approach 1:
The patent applies segmentation by separating the electrical contact function and temperature sensing function into distinct regions on the socket side. Electrical contacts are positioned in their traditional locations for optimal electrical performance, while temperature sensing is achieved through conductive traces that extend along the DUT surface away from the contact points. This spatial segmentation allows both functions to operate independently without mutual interference.
Solution Approach 2:
The conductive traces act as intermediaries that bridge the gap between electrical contacts and temperature measurement requirements. Rather than placing sensors directly at contact points, the traces extend from the contact regions along the DUT surface to capture temperature information. This intermediary approach maintains electrical contact integrity while providing accurate temperature measurement through the thermal conductivity of the traces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise temperature control and sensing on the socket side, improving thermal management by minimizing errors and optimizing thermal interface efficiency, even in scenarios where standard sensors are impractical or ineffective.
Implementation Method 1
the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device
Data Source
AI summary
An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device testing system further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.