Socket Temperature Control Module with Fluid Chamber
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Solution Overview
Problem
Current temperature control methods for testing electronic components are inefficient in precisely and uniformly controlling the temperature environment, as they primarily heat or cool the top portion of the device, leading to difficulties in maintaining a consistent temperature without waiting time for heating or cooling the chip to be tested.
Innovation Solution
A temperature control module for a socket comprising an upper and lower docking plate with a recess and temperature-controlling fluid passages, allowing the socket to be continuously maintained at a specific high- or low-temperature environment by circulating temperature-controlling fluid within a fluid chamber, enhancing test accuracy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal head directly contacts the electronic device to be tested for heating or cooling, then the electronic device can be heated or cooled, but the test fixture itself must wait to reach the same temperature through thermal conduction, causing waiting time
Solution Approach 1:
The invention divides the temperature control system into two independent parts: (1) a thermal head that directly contacts and heats/cooling the electronic device, and (2) a separate temperature control module with a fluid chamber that independently maintains the test fixture at the target temperature. This segmentation allows both components to operate at optimal temperatures simultaneously, eliminating the waiting time for thermal equilibrium between the fixture and device.
Solution Approach 2:
The invention introduces a fluid chamber filled with temperature control fluid as an intermediary between the temperature control device and the test fixture. The fluid acts as a thermal mediator that rapidly transfers heat to or from the fixture, enabling the fixture to reach and maintain the target temperature independently and quickly, without waiting for conduction from the thermal head.
2Temperature
If a thermal head heats or cools only the top portion of the electronic device, then direct contact temperature control is achieved, but it is difficult to precisely and uniformly control the temperature of the test environment
Solution Approach 1:
The invention applies different temperature control strategies to different locations: the thermal head provides localized intense heating or cooling at the contact point, while the fluid chamber provides distributed, uniform temperature control across the entire test fixture. This local quality differentiation enables both rapid temperature change and uniform temperature distribution throughout the test environment.
Solution Approach 2:
The invention transitions from one-dimensional contact heating (thermal head touching the device) to three-dimensional volumetric temperature control by filling the fluid chamber with temperature control fluid that surrounds and contacts the test fixture from multiple directions, achieving uniform temperature distribution throughout the entire test environment.
3Productivity
If the test fixture is not pre-heated or pre-cooled, then the testing process can start immediately, but the fixture cannot maintain a predetermined temperature during the test
Solution Approach 1:
The invention implements preliminary temperature control by equipping the test fixture with an independent fluid chamber system that can be pre-cooled or pre-heated before the actual test begins. The temperature control fluid is circulated through the fluid chamber in advance, bringing the fixture to the target temperature so that testing can start immediately without waiting for thermal equilibrium during the test process.
Solution Approach 2:
The invention ensures continuous temperature maintenance by keeping the temperature control fluid circulating through the fluid chamber throughout the entire test process. The fluid continuously absorbs or releases heat to the fixture, maintaining stable predetermined temperature conditions during testing, while allowing the test to proceed without interruption or waiting periods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module enables precise and uniform temperature control of the test environment, reducing waiting time for heating or cooling and improving test efficiency by maintaining the socket at a predetermined temperature, thereby enhancing the accuracy and speed of chip testing.
Implementation Method 1
the surrounding sidewalls of the socket is in contact with the temperature controlling fluid directly to perform heat exchange for increasing or decreasing temperature
Implementation Method 2
The temperature controlling fluid source feeds a temperature controlling fluid into the fluid chamber via the at least one temperature controlling fluid passage
Data Source
AI summary
A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.