Socket Thermal Conductor for High TDP CPU Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current cooling methods for CPU packages, such as heat sinks with air cooling, limit the thermal design power to around 300 watts and face challenges with Integrated Voltage Regulator (IVR) technology, which complicates thermal management due to the path of heat generated within Air Core Inductors (ACIs) following the same path as the die and Integrated Heat Spreader (IHS).
Innovation Solution
An auxiliary heat transfer path is introduced through a socket with a thermal conductor that couples the CPU package seated in the socket to the surface of a printed circuit board (PCB), utilizing high thermal conductivity gap filler material and a thermal via array to enhance heat dissipation, along with a steel socket stiffener to increase strength and heat transfer area, and a perforated chassis wall to support ambient air heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks with air cooling are used for CPU packages, then cooling is provided, but thermal design power is limited to around 300 watts
Solution Approach 1:
The heat dissipation function is segmented into multiple independent paths: the traditional top-side heat sink path and a new bottom-side thermal conductor path through the socket. This segmentation allows each path to operate independently, collectively increasing the total thermal design power capacity beyond the 300-watt limit of single-path air cooling.
Solution Approach 2:
The invention adds a new dimension to heat transfer by conducting heat through the socket body from the package substrate contact area to the PCB surface, rather than only through the traditional vertical path from die to heat sink. This dimensional expansion of the thermal conduction path enables additional heat dissipation capacity.
2Adaptability or versatility
If IVR technology with Air Core Inductors is implemented, then integrated voltage regulation is achieved, but thermal management is complicated due to heat following the same path as the die
Solution Approach 1:
The thermal management system is segmented into separate conduction paths: heat from the die travels through the IHS to the heat sink, while heat from the ACIs in the IVR is conducted through the package substrate to the socket's thermal conductor and then to the PCB. This segmentation separates the thermal paths of different heat-generating components, simplifying thermal management despite the added IVR complexity.
Solution Approach 2:
The socket's thermal conductor acts as an intermediary element that receives heat from the package substrate (including heat from ACIs) and transfers it to the PCB for dissipation. This intermediary provides a dedicated thermal pathway for IVR-generated heat, preventing it from following the same path as die heat and reducing thermal management complexity.
3Power
If a thermal conductor is added to the socket to provide an auxiliary heat transfer path, then thermal design power is increased beyond 300 watts, but device complexity increases
Solution Approach 1:
The thermal conductor is merged with the socket body, integrating the heat transfer function directly into the existing socket structure rather than adding a separate component. The socket simultaneously provides electrical connection, mechanical support, and thermal conduction functions through this integrated design, minimizing the increase in device complexity while achieving enhanced thermal design power.
Solution Approach 2:
The socket is designed with multi-functionality: it provides electrical connection between package and PCB, mechanical support for the package, and thermal conduction through the thermal conductor. By combining multiple functions in a single component, the invention increases thermal design power without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases thermal design power beyond the 300-watt limit by providing an additional heat transfer path, improving cooling efficiency and addressing the thermal management challenges posed by IVR technology and ACIs.
Implementation Method 1
a thermal conductor to thermally couple an area of the first side of the socket to an area of the second side of the socket
Data Source
AI summary
Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.