Socket Wicking Region for Compact Board Sealing and Attachment
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Solution Overview
Problem
Circuit board assemblies face space consumption and communication degradation due to the use of traditional socket attachment methods, which require significant board space and spacing between components, affecting communication speed and reliability.
Innovation Solution
A socket with a wicking region for adhesive attachment that allows for a 'smart glue' effect, enabling a high-strength bond and dust/moisture seal while conforming to irregular shapes, using a top-down dispense approach to distribute adhesive efficiently and minimize space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional socket attachment methods are used, then the socket can be securely attached to the system board, but significant board space is consumed and spacing between components increases
Solution Approach 1:
The socket base incorporates a wicking region with a porous structure that enables capillary action to draw adhesive from the dispensing region into the base, creating a strong bond without requiring extensive adhesive application or large board space
Solution Approach 2:
The wicking region acts as an intermediary between the adhesive dispensing region and the socket base, controlling adhesive flow through capillary action to achieve secure attachment while minimizing space requirements
2Strength
If traditional socket attachment methods are used, then the socket can be securely attached, but spacing between circuit components must be increased
Solution Approach 1:
The porous wicking region enables efficient adhesive distribution with minimal material, allowing compact circuit layouts without compromising attachment strength or requiring increased spacing between components
Solution Approach 2:
The invention changes the adhesive application parameters by using capillary action instead of traditional dispensing methods, enabling precise adhesive placement that supports higher component density
3Strength
If adhesive is dispensed directly onto the system board, then the socket can be attached, but adhesive distribution is inefficient and space is wasted
Solution Approach 1:
The wicking region serves as an intermediary that receives adhesive at a centralized dispensing location and automatically distributes it throughout the socket base via capillary action, improving manufacturing efficiency and adhesive utilization
Solution Approach 2:
The porous wicking structure enables self-service adhesive distribution through capillary action, eliminating the need for complex dispensing systems or manual adhesive application while achieving uniform distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wicking region allows for compact circuit layouts with enhanced communication speed and reliability by securing connectors without the need for extensive board space, while withstanding mechanical forces and solder reflow conditions.
Implementation Method 1
a wicking region (420) to wick adhesive from the system board (430) into the wicking region (420), thereby establishing a seal
Data Source
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AI summary
An example device in accordance with an aspect of the present disclosure includes a base to be mounted to a system board, A wicking region at the base is to vvick adhesive into the wicking region to seal the base to the system board.