Multi-chip module with removable socketed sub-modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multi-chip modules face challenges during device fabrication and assembly due to complex substrate requirements for interconnections and the need for pre-assembly testing, which can lead to incompatibilities and suboptimal performance, increasing costs and requiring substantial rework.
Innovation Solution
The multi-chip module design includes self-contained, separately testable chip sub-modules with organic substrates and sockets, allowing for pre-testing and easy replacement, along with a mini-card organic substrate that electrically couples these sub-modules, and a downstop to prevent solder creep.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chip sub-modules are pre-assembled and tested together, then system performance can be optimized, but incompatibilities may arise and substantial rework is required if issues are detected
Solution Approach 1:
The system is divided into separate chip sub-modules, each with its own organic substrate and interconnects. These modules can be independently tested and replaced without affecting other modules, eliminating the need for substantial rework while maintaining system performance optimization.
Solution Approach 2:
Chip sub-modules are configured as separately testable entities before final assembly. This preliminary testing allows defects to be identified early in the fabrication process, enabling easy replacement rather than requiring substantial rework after complete assembly.
2Quantity of substance
If complex substrate requirements are used for interconnections, then higher interconnect density is achieved, but device fabrication complexity increases
Solution Approach 1:
The complex interconnection system is segmented across multiple organic substrates, each handling specific interconnect functions. This modular approach achieves high interconnect density while simplifying fabrication by breaking down the complex substrate requirements into manageable segments.
Solution Approach 2:
The patent employs multi-layer organic substrates with vertical stacking to achieve high interconnect density in three dimensions. This dimensional approach increases interconnect quantity without proportionally increasing fabrication complexity, as the layered structure follows standardized manufacturing processes.
3Ease of repair
If chip sub-modules are made removable with sockets, then ease of replacement and rework is improved, but device complexity increases
Solution Approach 1:
The socket interface serves multiple functions: it provides mechanical support for chip sub-modules, enables electrical connections through interconnects, and facilitates easy removal and replacement. This multi-functionality achieves ease of repair without significantly increasing overall device complexity.
Solution Approach 2:
The socket acts as an intermediary component between the chip sub-module and the organic substrate. This mediator enables easy replacement while managing the complexity of electrical interconnections, as the socket provides a standardized interface that simplifies the overall module structure.
Data Source
AI summary
A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.