Socketless LGA Using Adhesive for Optical Module Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing mid-plane mounting solutions for parallel optical communications modules using LGA sockets are costly, time-consuming, and require manual assembly, as well as restrict the routing of electrical conductors on the host PCB due to the need for drilling holes and additional hardware.
Innovation Solution
A socketless land grid array (LGA) is implemented using non-electrically-conductive adhesive material to secure the optical communications module to the host circuit board, eliminating the need for sockets and allowing for direct contact and alignment of electrical contacts, thereby reducing assembly complexity and enabling conductor routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LGA sockets with drilling holes and fastening devices are used to secure the optical communications module to the host PCB, then the module is mechanically secured and electrical contacts are established, but the cost increases, assembly time increases, and the routing of electrical conductors is restricted
Solution Approach 1:
The patent removes the LGA socket as a separate component and extracts only the essential functions: electrical contact and mechanical securing. The electrical contacts are placed directly on the host PCB surface, and the socket structure with its side walls, bottom, and fastening mechanisms is completely eliminated, replacing it with adhesive bonding.
Solution Approach 2:
The patent merges the functions of the LGA socket, mounting hardware, and adhesive bonding into a single integrated solution. The electrical contacts on the PCB serve both electrical and mechanical positioning functions, while the adhesive simultaneously provides mechanical securing and environmental protection, eliminating the need for separate sockets and fastening devices.
2Ease of operation
If LGA sockets with side walls and bottom are used to locate and hold the optical communications module, then the module is positioned and secured, but the cost and size of the mounting solution increase
Solution Approach 1:
The patent removes the physical socket structure with its side walls and bottom enclosure, extracting only the essential function of module positioning and securing. The electrical contact array on the PCB provides localization, while adhesive bonding provides securing, eliminating the need for the bulky socket housing.
3Strength
If holes are drilled through the host PCB and fastening devices are inserted to secure the LGA socket, then the socket is mechanically attached, but electrical conductors cannot be routed through the drilled locations
Solution Approach 1:
The patent removes the drilling and fastening device attachment method entirely, extracting only the essential function of mechanical attachment. Adhesive bonding is used instead, which does not require holes or fasteners, thereby preserving the full routing flexibility of the PCB for electrical conductors.
Solution Approach 2:
The patent replaces the mechanical attachment system (drilling holes and inserting fasteners) with a chemical bonding system (adhesive). This substitution eliminates the need for physical penetration of the PCB, allowing electrical conductors to be routed freely without obstruction from holes or fastening hardware.
4Reliability
If LGA sockets are hand-assembled with drilling, soldering, and plate attachment, then the socket is securely mounted, but the assembly process becomes time-consuming and expensive
Solution Approach 1:
The patent removes the multi-step hand-assembly process (drilling, soldering, plate attachment) and extracts only the essential outcome of secure mounting. The adhesive bonding process allows for simplified assembly that can be performed more quickly and with less skill, thereby increasing productivity and reducing cost while maintaining mounting security.
Solution Approach 2:
The patent replaces the complex mechanical assembly process involving multiple steps (drilling, soldering, plate attachment) with a simpler chemical bonding process using adhesive. This substitution reduces the number of assembly steps, lowers the skill level required, increases assembly speed, and reduces overall cost while achieving the same secure mounting result.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the cost and size of the mounting solution, simplifies the assembly process, and allows for the use of the host PCB area for electrical pathways, while maintaining a flat profile and ensuring reliable electrical contact.
Implementation Method 1
a first amount of non-electrically-conductive adhesive material disposed on the first surface of the first host CB in the first mounting region
Data Source
AI summary
A socketless land grid array (LGA) is provided that uses an adhesive material rather than a socket to secure the optical communications module to the LGA and to provide the clamping force that is needed to maintain contact between the module and the LGA and to maintain a flat profile for the module and the LGA. Eliminating the LGA socket eliminates the need to drill holes in the host circuit board and the need for additional hardware (e.g., backing plates, screws, etc.) to secure a socket to the host circuit board. This allows the area of the host circuit board underneath the array of electrical contacts of the LGA to be used for routing electrically-conductive pathways of the host circuit board (e.g., vias and traces) and reduces the amount of time and effort that are needed to secure modules to the respective LGAs.