SOEC/SOFC Interconnector Relief Layout for Contact and Gas Flow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing high-temperature solid oxide cell stacks face challenges in achieving optimal electrical contact, gas distribution, and mechanical stability, leading to inefficiencies and potential damage from hot spots and pressure losses.
Innovation Solution
The design of an interconnector with varying relief elements of different geometric characteristics, such as teeth or grooves, ensures both effective electrical contact and efficient gas circulation by allowing for adjustable crushing and reduced pressure losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform relief elements are used on the interconnector, then the manufacturing process is simple, but the electrical contact and gas distribution cannot be optimized simultaneously
Solution Approach 1:
The interconnector features relief elements with different heights in different zones: first relief elements with a first height in a first zone, and second relief elements with a second height in a second zone. This local variation allows optimization of electrical contact in one area while maintaining gas distribution in another, resolving the contradiction between manufacturing simplicity and electrical contact quality.
Solution Approach 2:
The relief elements are segmented into multiple groups with different geometric characteristics. The interconnector surface is divided into zones with different relief element configurations, allowing each zone to perform its specific function (electrical contact or gas distribution) independently while maintaining overall system reliability.
2Reliability
If relief elements with large contact width are used, then electrical conductivity is improved, but pressure losses increase due to reduced gas circulation space
Solution Approach 1:
Relief elements in the first zone have a first contact width optimized for electrical conductivity, while relief elements in the second zone have a second contact width optimized for gas circulation. This local differentiation allows the system to achieve good electrical contact without sacrificing gas flow pathways, thereby reducing pressure losses.
Solution Approach 2:
The contact width of relief elements is segmented into different values across the interconnector surface. By dividing the relief elements into groups with different contact widths, the system can provide wide contact areas for electrical conduction in specific zones while maintaining narrow relief elements elsewhere to preserve gas circulation channels and minimize pressure drops.
3Reliability
If relief elements with large height are used, then electrical contact pressure is improved, but mechanical stability decreases due to increased susceptibility to geometric defects
Solution Approach 1:
The relief elements have different heights in different zones: some zones have taller relief elements for optimal electrical contact pressure, while other zones have shorter relief elements for better mechanical stability and reduced sensitivity to geometric defects. This local optimization allows the system to achieve the necessary contact pressure without compromising overall mechanical stability.
Solution Approach 2:
The relief element heights are segmented into multiple levels across the interconnector. By varying the height of relief elements in different zones, the system can provide high contact pressure where needed while maintaining structural robustness in other areas, thereby reducing the impact of geometric defects on overall mechanical stability.
4Reliability
If multiple types of relief elements with different geometries are used, then electrical contact and gas distribution are optimized, but device complexity increases
Solution Approach 1:
The interconnector employs relief elements with different geometric characteristics in different zones, allowing each zone to be optimized for its specific function. While this creates local complexity, the overall device structure remains relatively simple, and the manufacturing process can be standardized, thereby limiting the increase in device complexity while achieving performance optimization.
Data Source
Figure 1~2
Figure 3~3B
Figure 4~5
AI summary
The invention relates mainly to an interconnector for a stack of solid oxide cells of the SOEC/SOFC type, intended to be arranged between two adjacent electrochemical cells, characterised in that it comprises a flat face (P) on which at least a first group of identical first relief elements (10a) and a second group of identical second relief elements (10b) are formed, the first relief elements (10a) having different geometric characteristics with respect to the second relief elements (10b), the height (H1) of each first relief element (10a) being different from the height (H2) of each second relief element (10b), the contact width (D1) of each first relief element (10a) being different from the contact width (D2) of each second relief element (10b).