SOFC Interconnector Rough Region Sealing

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Solution Overview

Problem

Existing electrochemical devices, such as Solid Oxide Fuel Cells (SOFC) and Solid Oxide High Temperature Steam Electrolyzers (SOEC), face challenges with sealing inefficiencies, leading to leaks and potential cell defects due to inadequate insulation and gas recombination, which can cause efficiency decreases and damage.

Innovation Solution

The introduction of a conducting support element with localized rough regions for improved attachment of insulating glass or glass-ceramic bonding materials, enhancing sealing by modifying the surface state through techniques like blasting to create a patterned roughness, and using an insulating support with central and peripheral openings for bead distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a smooth surface is used on the interconnector for sealing, then the manufacturing process is simple, but the sealing attachment is insufficient leading to leaks

Engineering Contradiction:

Improvesealing attachmentVSAvoidsurface preparation

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies local quality by creating rough regions only at specific sealing locations on the interconnector surface, rather than making the entire surface rough. This localized surface modification provides enhanced sealing attachment exactly where needed (at the seal contact points) while keeping the rest of the surface smooth for easy manufacturing and assembly. The rough regions are formed by selective blasting or other surface treatment methods applied only to the sealing zones.

Inventive Principle:

Principle #3Local quality

2Reliability

If a rough surface is created on the interconnector to improve sealing, then the attachment of bonding material is improved, but the manufacturing complexity increases

Engineering Contradiction:

Improvesealing tightnessVSAvoidsurface structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements local quality by limiting surface roughness to specific sealing regions rather than the entire interconnector surface. This approach creates the necessary complexity only where sealing is required, while maintaining simple smooth surfaces elsewhere. The selective application of surface treatment minimizes overall device complexity while achieving the desired sealing improvement at critical locations.

Inventive Principle:

Principle #3Local quality

3Productivity

If insulating seals are not properly sealed, then gas recombination occurs causing efficiency decrease, but improving sealing increases manufacturing complexity

Engineering Contradiction:

Improveoperational efficiencyVSAvoidsealing structure

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent applies local quality by creating rough surfaces only at the sealing contact points on the interconnector. This localized modification provides the enhanced bonding needed to prevent gas recombination and maintain operational efficiency, without requiring complex sealing structures throughout the entire device. The simple targeted surface treatment achieves the necessary sealing performance to prevent leaks and maintain productivity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly improves the anchoring of insulating seals, reducing leaks and enhancing the operational efficiency and durability of electrochemical devices by ensuring better thermal expansion accommodation and electrical insulation.

Implementation Method 1

By degrading or modifying the surface state of a given region of the interconnector thus roughened, the attachment of the seal and more precisely of the bonding material of glass or glass-ceramic contacted with this given region of the interconnector is improved.

Methodology Applied

Scientific EffectMechanical interlocking:

Implementation Method 2

A proper operation of this stack type requires an electric insulation between two successive interconnectors, otherwise the cell may be short-circuited.

Methodology Applied

Scientific EffectElectrical insulation:

Implementation Method 3

It is also attempted to provide sealing between different compartments in order to avoid an inopportune gas recombination likely to cause a decrease in efficiency and a possible occurrence of hot spots causing damage to the stack.

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS11322753B2Interconnector with a rugged surface for better tightness

Publication Date: 2022.05.03 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

AI summary

Implementation of an interconnector structure for an SOEC or SOFC electrochemical device, the interconnector being formed of a conductive support element having a first face with a rough region, the roughness of which has been modified locally before being brought into contact with a seal.