Soft-Coated Power Module Interface for Low Thermal Resistance
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Solution Overview
Problem
Conventional power electronics modules face challenges in achieving efficient and reliable thermal connection between the module and cooling devices due to high thermal resistance, especially at maximum power operation, where conventional aluminum heatsinks struggle to spread heat effectively, leading to increased temperatures and potential mechanical issues with thermal interface materials.
Innovation Solution
A soft coating, preferably made of indium, copper, tin, graphite, or polymer, is applied directly to the metallic structure of the power electronics module, forming an outer surface that deforms to fill gaps and enhance thermal conductivity, eliminating the need for separate thermal interface materials and improving heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional aluminum heatsinks are used for cooling, then the cooling device is simple and cost-effective, but the thermal resistance is high and heat spreading efficiency is insufficient at maximum power operation
Solution Approach 1:
The patent changes the physical state and properties of the interface between the heat transfer structure and cooling device by introducing a phase-change material. This material transitions from solid to liquid and back, dynamically adapting to thermal conditions and improving heat transfer efficiency without changing the fundamental structure of the aluminum heatsink.
Solution Approach 2:
The phase-change material acts as an intermediary substance between the heat transfer structure and the aluminum heatsink. It mediates the thermal interaction by filling gaps and providing enhanced thermal coupling, allowing efficient heat transfer while maintaining compatibility with conventional cooling devices.
2Reliability
If thermal interface materials are used to fill gaps between surfaces, then thermal resistance is reduced, but mechanical integrity deteriorates due to pumping out and degradation under thermal cycling
Solution Approach 1:
The integrated heat transfer structure with embedded phase-change material serves itself by automatically adapting to thermal and mechanical conditions. The material self-regulates the interface quality through phase transitions, eliminating the need for separate thermal interface materials that require external application and maintenance.
Solution Approach 2:
The patent creates a composite structure where the heat transfer structure integrates multiple materials including the phase-change material within its body. This composite design combines the structural integrity of the heat transfer structure with the thermal adaptability of the phase-change material, eliminating weak interface layers.
3Manufacturing precision
If the contact surfaces are made perfectly smooth and planar to reduce air gaps, then manufacturing precision increases, but the adaptability to surface irregularities and thermal cycling decreases
Solution Approach 1:
The patent introduces dynamic adaptability into the thermal interface through the phase-change material. Rather than relying on static perfect planarity, the system dynamically adjusts to surface irregularities and thermal cycling through phase transitions, maintaining optimal thermal contact under varying conditions.
Solution Approach 2:
The system changes its physical parameters (phase state) in response to thermal conditions rather than relying on fixed geometric parameters. This allows the interface to adapt to surface irregularities and thermal cycling without requiring extremely precise manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The soft coating significantly reduces thermal resistance, allowing for more efficient heat dissipation and easier installation, with indium-based coatings offering up to 16 to 40 times higher thermal conductivity than conventional materials, while maintaining mechanical integrity and adaptability during module operation.
Implementation Method 1
The soft coating is configured to deform to fill gaps between a surface of the heat transfer structure and a surface of a cooling device
Implementation Method 2
The soft coating significantly reduces thermal resistance, allowing for more efficient heat dissipation
Data Source
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AI summary
A power electronics module and a method of producing a power electronics module. The module comprises multiple of power electronic semiconductor chips incorporated in a housing, and a heat transfer structure having a surface which forms an outer sur-face of the module and is adapted to receive a surface of a cooling device, wherein the heat transfer structure comprises a metallic structure having a soft coating.