Soft Dilute Copper Alloy Wire Fine Grain Structure Bending Life
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Solution Overview
Problem
Existing copper alloys for soft wires struggle to balance high conductivity with flexibility and bending life, as they often have low conductivity due to additional elements and are not suitable for applications requiring repeated bending and torsion.
Innovation Solution
A soft dilute copper alloy material composed of copper, specific additional elements like Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr, with a recrystallized structure and controlled sulfur and oxygen content, which maintains a fine crystal grain size in the surface layer to enhance conductivity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If additional elements are added to copper to improve flexibility, then bending characteristics improve, but conductivity decreases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the concentrations of additional elements (In: 0.01-0.5 wt%, P: 0.001-0.01 wt%, B: 0.001-0.01 wt%) to achieve the optimal balance between flexibility and conductivity. By adjusting these compositional parameters within specific ranges, the material achieves both improved bending characteristics and maintained high conductivity.
Solution Approach 2:
The patent creates a composite copper alloy material by combining copper with multiple additional elements (In, P, B) in specific proportions. This composite structure leverages the beneficial properties of each element: In for flexibility, P for conductivity, and B for grain refinement, achieving a synergistic effect that resolves the contradiction between flexibility and conductivity.
2Ease of operation
If wire drawing compression ratio is increased to refine crystal structure, then flexibility improves, but work hardening increases making the material unsuitable for soft wire applications
Solution Approach 1:
The patent applies parameter changes by optimizing the wire drawing compression ratio within a specific range (40-70%) to achieve fine crystal grain structure without excessive work hardening. Additionally, the composition parameters (In: 0.01-0.5 wt%, P: 0.001-0.01 wt%, B: 0.001-0.01 wt%) are adjusted to control the material's hardening characteristics during deformation.
Solution Approach 2:
The patent uses phosphorus (P) and boron (B) as intermediary elements that mediate between the crystal structure refinement and work hardening effects. These elements control the dislocation movement and grain boundary behavior during wire drawing, allowing fine grain structure to form without excessive hardening, thus enabling the material to remain suitable for soft wire applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alloy achieves high conductivity exceeding 98% IACS and a long bending life by preventing crack development through a fine crystal grain size, making it suitable for applications with extreme bending and torsion.
Implementation Method 1
a soft dilute copper alloy material which comprises copper, at least one additional element selected from the group consisting of Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of an inevitable impurity, wherein an average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface
Data Source
AI summary
A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.