Soft Inserts for IC Package Strip Singulation Friction
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Solution Overview
Problem
Existing IC package strip support assemblies fail to prevent movement during singulation, particularly when the molded portion has a smoother surface, leading to defects such as trapezoidal shapes due to insufficient frictional forces.
Innovation Solution
A support assembly for a saw table that includes a support plate with inserts made from a softer material, providing additional frictional resistance through a combination of vacuum force and the inserts' lower hardness, which enhances the holding capability of IC package strips during singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a standard support plate is used for IC package strips, then the assembly is simple, but the frictional force is insufficient to prevent movement during singulation
Solution Approach 1:
The support assembly uses a composite structure combining a support plate made of harder material (e.g., metal or hard plastic) with inserts made of softer, higher-friction material (e.g., rubber or silicone). This composite approach increases the frictional force between the support surface and the IC package strip without significantly complicating the overall assembly, as the inserts can be embedded into recesses in the support plate.
2Manufacturing precision
If a smoother surface mold compound is used for IC packages, then the package quality is improved, but the frictional force decreases leading to movement during singulation
Solution Approach 1:
The support assembly applies local quality by using softer inserts with higher friction coefficients at the specific contact points where the support plate meets the IC package strip. This allows the bulk of the support plate to remain hard and durable, while the localized insert surfaces provide the necessary friction to prevent movement, even when the mold compound surface is smooth.
3Strength
If a harder support plate material is used, then the support plate durability is improved, but the frictional force is reduced causing strip movement
Solution Approach 1:
The support assembly uses a composite structure combining a support plate made of harder material (e.g., metal or hard plastic) with inserts made of softer, higher-friction material (e.g., rubber or silicone). This composite approach increases the frictional force between the support surface and the IC package strip without significantly complicating the overall assembly, as the inserts can be embedded into recesses in the support plate.
4Force
If more powerful vacuum systems are used to prevent movement, then the holding capability is improved, but the system complexity and cost increase
Solution Approach 1:
The softer inserts act as an intermediary between the vacuum system and the IC package strip. They enhance the effectiveness of the vacuum force by providing better contact and adherence to the strip surface, while also contributing additional frictional force. This allows a standard vacuum system to achieve sufficient holding capability without requiring more powerful (and more complex) vacuum equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents movement of IC package strips during singulation, reducing defects and eliminating the need for more powerful vacuum systems, thereby preserving the inserts and maintaining assembly efficiency.
Implementation Method 1
a vacuum source in fluid communication with the plurality of holes adapted to provide a vacuum force to hold the IC package strip on the support plate
Implementation Method 2
providing additional frictional resistance through a combination of vacuum force and the inserts' lower hardness
Data Source
AI summary
A plurality of inserts adapted are to be received in a plurality of holes in a support plate having a first surface adapted to engage a first surface of an integrated cicuirt IC package strip. The support plate has a plurality of holes in fluid communication with a vacuum source and are constructed from a first material having a first hardness. The plurality of inserts are constructed from a second material having a second hardness less than said first hardness.