Soft-Magnetic Multi-Layer Substrate DC-DC Converter
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Solution Overview
Problem
Existing DC-DC converters face challenges in miniaturization due to large inductors, magnetic flux leakage, parasitic inductance, and inadequate heat dissipation, which affect conversion efficiency and noise levels.
Innovation Solution
A DC-DC converter design utilizing a soft-magnetic, multi-layer substrate with laminated coils and a semiconductor integrated circuit mounted on the substrate, featuring a magnetic gap to reduce magnetic flux leakage, exposed second connecting wires to minimize parasitic inductance, and an overcoat for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If higher switching frequencies are used to reduce converter size, then the converter size is reduced, but output voltage fluctuation (ripple) increases
Solution Approach 1:
The patent divides the converter into multiple phases (e.g., two-phase or three-phase configuration) where each phase operates at a lower switching frequency. By segmenting the power conversion task across multiple parallel paths with different phase shifts (180° for two-phase, 120° for three-phase), the overall converter achieves high-frequency performance while each individual phase operates at manageable frequencies, reducing output voltage ripple.
2Volume of moving object
If inductors are made smaller to reduce converter size, then converter size is reduced, but magnetic flux leakage increases
Solution Approach 1:
The patent introduces a magnetic shield layer as an intermediary component between the inductor and the semiconductor integrated circuit. This magnetic shield acts as a mediator that redirects and contains the magnetic flux within the inductor, preventing it from leaking into the control circuit area. The magnetic shield layer is integrated into the multi-layer substrate structure, effectively suppressing magnetic flux leakage without increasing the overall converter size.
3Ease of manufacture
If circuit elements are mounted on a printed circuit board with connecting lines, then ease of manufacture is improved, but parasitic inductance increases
Solution Approach 1:
The patent merges the inductor and the semiconductor integrated circuit into a single integrated structure mounted on a multi-layer substrate. The inductor is formed directly on the substrate using laminated coils, and the semiconductor device is mounted in close proximity with minimal external connecting lines. This integration reduces the length of current paths and minimizes parasitic inductance while maintaining ease of manufacture through standardized mounting procedures.
4Object-generated harmful factors
If inductors are made larger to reduce magnetic flux leakage, then magnetic flux leakage is reduced, but converter size increases
Solution Approach 1:
The patent introduces a magnetic shield layer as an intermediary component between the inductor and the semiconductor integrated circuit. This magnetic shield acts as a mediator that redirects and contains the magnetic flux within the inductor, preventing it from leaking into the control circuit area. The magnetic shield layer is integrated into the multi-layer substrate structure, effectively suppressing magnetic flux leakage without increasing the overall converter size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves reduced magnetic flux leakage, lower parasitic inductance, and enhanced heat dissipation, leading to a compact, high-efficiency DC-DC converter with improved voltage conversion efficiency and reduced noise.
Implementation Method 1
an output inductor Lout for storing and discharging current energy
Implementation Method 2
switching devices (for instance, field effect transistors) in the semiconductor integrated circuit IC are switched according to a control signal, to lower a DC input voltage Vin to an output voltage Vout
Implementation Method 3
an output capacitor Cout for storing and discharging voltage energy
Data Source
Figure 1~2
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Figure 5~6
AI summary
A DC-DC converter comprising a soft-magnetic, multi-layer substrate provided with a laminated coil constituted by connecting pluralities of conductor lines, and a semiconductor integrated circuit device comprising a switching device and a control circuit, which are mounted on the soft-magnetic, multi-layer substrate; the semiconductor integrated circuit device comprising an input terminal, an output terminal, a first control terminal for controlling the ON/OFF of the switching device, a second control terminal for variably controlling output voltage, and pluralities of ground terminals; the soft-magnetic, multi-layer substrate comprising first external terminals formed on a first main surface, first connecting wires formed on the first main surface and/or on nearby layers, second connecting wires formed between the side surface of the multi-layer substrate and a periphery of the laminated coil, and second external terminals formed on a second main surface; and terminals of the semiconductor integrated circuit device being connected to the first external terminals on the multi-layer substrate, at least part of the first external terminals being electrically connected to the second external terminals through the first and second connecting wires, and the input or output terminal being connected to the second external terminals via the laminated coil.