Soft Magnetic Multilayer Sputtering for Precise Thin-Film Stacks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for miniaturization of integrated induction-based devices such as transformers and induction coils operating at high frequencies, and existing techniques lack efficient methods for depositing well-controlled stacks of very thin soft magnetic materials for improved high-frequency behavior.
Innovation Solution
A soft magnetic material multilayer deposition apparatus with a circular vacuum transport chamber and rotational drive, featuring multiple substrate carriers and treatment stations with aligned sputter deposition stations for continuous, non-reactive deposition of thin layers from single targets of different soft magnetic materials, ensuring accurate stoichiometry and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional magnetron sputter deposition with faced target arrangement is used, then deposition of soft magnetic material layers can be achieved, but the deposition process lacks precise control over stoichiometry and layer thickness for very thin layers
Solution Approach 1:
The deposition process is segmented into multiple sequential deposition steps, with the substrate carrier making multiple revolutions (at least two complete 360-degree rotations) to deposit alternating layers of different soft magnetic materials. Each deposition station deposits a specific material layer, and the segmented approach allows precise control over individual layer thickness and composition while maintaining overall process simplicity
Solution Approach 2:
The substrate carrier performs periodic rotational movements, making at least two complete revolutions through the deposition stations. This periodic action ensures that each layer is deposited under consistent, controlled conditions while allowing time for proper layer formation and stoichiometry control. The regular intervals between deposition events enable precise thickness control for very thin layers
2Stability of the object's composition
If reactive sputter deposition is used, then soft magnetic material layers can be deposited, but the stoichiometry control and stability over time are insufficient
Solution Approach 1:
The system performs preliminary preparation of the substrate surface and vacuum chamber conditions before each deposition cycle. The substrate carrier is pre-positioned, and the deposition stations are pre-configured with the correct materials and parameters. This preliminary action ensures that when deposition begins, all conditions are optimized for precise stoichiometry control and stable layer composition from the first moment of material deposition
Solution Approach 2:
The deposition process incorporates feedback mechanisms where the rotation speed, deposition time, and material flux are continuously monitored and adjusted to maintain precise stoichiometry. The system uses feedback from layer thickness measurements and deposition rate monitoring to ensure each layer achieves the desired composition and thickness, with automatic adjustments to maintain stability over time
3Reliability
If multiple soft magnetic material layers are stacked to improve high-frequency characteristics, then device performance improves, but the deposition process becomes less efficient and harder to control
Solution Approach 1:
Multiple deposition stations are merged into a single integrated apparatus, with each station capable of depositing a different soft magnetic material. The substrate carrier passes through all stations in sequence during its rotation, combining what would otherwise be separate deposition processes into one efficient operation. This merging maintains high deposition efficiency while achieving the complex multilayer structures needed for improved high-frequency performance
Solution Approach 2:
The deposition process maintains continuous useful action by keeping the substrate carrier in constant rotation through at least two complete revolutions, with deposition occurring continuously at each station as the substrate passes by. There are no idle periods or interruptions between layer depositions, as the system seamlessly transitions from depositing one material layer to the next. This continuous operation maximizes productivity while ensuring consistent layer quality and precise control over the multilayer stack
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of soft magnetic multilayer stacks with improved high-frequency characteristics, allowing for the miniaturization of inductive microdevices by achieving precise control over layer thickness and composition, thereby enhancing their performance.
Implementation Method 1
The first soft magnetic material to be deposited as layer material of a very thin layer on the substrates and is sputtered from solid single target... The second soft magnetic material to be deposited as material of a very thin layer on the substrates is as well sputtered from single target solid
Data Source
Figure 1
Figure 2
Figure 3(a)~3(e)
AI summary
The soft magnetic material multilayer deposition apparatus comprises a circular arrangement of a multitude of substrate carriers (11) in a circular inner space of a vacuum transport chamber (3). In operation the substrate carriers (11) pass treatment stations (17A, 17B). One of the treatment stations (17A) has a sputtering target (TA) consisting of a first soft magnetic material. A second treatment station (17B) comprises a target (TA) consisting of a second soft magnetic material which is different from the first soft magnetic material of the first addressed target (TA). A control unit (23) controlling relative movement of the substrate carriers (11) with respect to the treatment stations (17A, 17B) provides for more than one 360° revolution of the multitude of substrate carriers (11) around the axis AX of the circular inner space of the vacuum transport chamber (3), while the first and second treatment stations (17A, 17B) are continuously operative.