Soft Metal Thermal Interface for Substrate Cooling

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in achieving efficient heat conduction between the stage and the freezing device due to high thermal resistance at the contact interface, which affects cooling performance and processing uniformity.

Innovation Solution

Incorporating a heat conductive member made of soft metal, such as indium, between the stage and the freezing device, which is elastically deformable and has a lower hardness than the materials of the stage and the freezing device, to reduce thermal resistance and enhance heat conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat conductive member made of soft metal is interposed between the stage and freezing device, then thermal resistance at the contact interface is reduced and heat conduction is enhanced, but the device structure becomes more complex

Engineering Contradiction:
Improvethermal resistanceVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

A heat conductive member made of soft metal (such as indium) is introduced as an intermediary between the stage and freezing device. This soft metal layer fills micro-gaps and irregularities at the contact interface, creating intimate thermal contact and significantly reducing thermal resistance. The soft metal acts as a mediator that improves heat transfer without requiring complex mechanical pressure systems or specialized contact surface geometries.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the freezing device is brought closer to the stage to reduce thermal resistance, then cooling performance is improved, but the risk of contamination between the freezing device and stage increases

Engineering Contradiction:
Improvecooling performanceVSAvoidcontamination risk
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The soft metal heat conductive member serves as a protective intermediary layer between the freezing device and stage. It enables effective thermal contact while maintaining a physical barrier that prevents direct contact between the components, thereby eliminating contamination risks associated with bringing the freezing device too close to the stage.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The soft metal heat conductive member functions as a flexible thin film that conforms to the surface irregularities of both the stage and freezing device. This flexible layer maintains intimate thermal contact for improved cooling performance while acting as a protective barrier that prevents contamination between the two components.

Inventive Principle:
Principle #30Flexible shells and thin films

3Device complexity

If direct contact between the stage and freezing device is used, then the device structure is simpler, but thermal resistance is high and cooling performance is insufficient

Engineering Contradiction:
Improvedevice complexityVSAvoidthermal resistance
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The soft metal heat conductive member is introduced as a simple intermediary layer that dramatically improves thermal contact between the stage and freezing device. Rather than complicating the device structure with active control systems or specialized mechanisms, this passive soft metal layer naturally conforms to surface irregularities and reduces thermal resistance through its excellent thermal conductivity and deformability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of a soft metal heat conductive member reduces thermal resistance, allowing for improved cooling performance and faster temperature stabilization of the stage, enabling more efficient substrate processing.

Implementation Method 1

a heat conductive member interposed between the first contact surface and the second contact surface, wherein the heat conductive member is made of a soft metal that is softer than at least one of a material of the first contact surface or a material of the second contact surface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240209509A1Substrate processing apparatus
Publication Date: 2024.06.27 TOKYO ELECTRON LTD
  • US20240209509A1 patent drawing
  • US20240209509A1 patent drawing
  • US20240209509A1 patent drawing

AI summary

A substrate processing apparatus includes: a stage having a first contact surface; a freezing device having a second contact surface; an elevating device to be capable of thermally connecting or separating the second contact surface and the first contact surface; and a heat conductive member interposed between the first contact surface and the second contact surface, wherein the heat conductive member is made of a soft metal that is softer than at least one of a material of the first contact surface or a material of the second contact surface.