Soft Transfer Mold Wiring on Textured Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current wiring formation methods, such as printing and transfer molding, face limitations in forming high aspect ratio wiring on substrates with recesses and protrusions, requiring a smoothing process that increases effort and cost.
Innovation Solution
A soft transfer mold with a durometer A hardness of 40-70, made from a resin material with a silicone polymer compound and a curing agent in a 5:1 mixing ratio, is used to deform and make close contact with the substrate, allowing for the formation of high aspect ratio wiring without a smoothing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a hard transfer mold is used for wiring formation, then the wiring pattern can be precisely transferred, but the mold cannot contact the substrate surface when recesses and protrusions are present
Solution Approach 1:
The patent changes the physical parameter of the transfer mold from hard to soft, specifically using a silicone rubber material with Shore A hardness of 20-70. This parameter change allows the mold to deform and conform to substrate surface variations while maintaining pattern transfer accuracy through the material's elastic recovery properties
Solution Approach 2:
The patent employs a flexible transfer mold made of silicone rubber that can elastically deform to contact the substrate surface irregularities. The flexible material conforms to recesses and protrusions, ensuring complete surface contact while transferring the wiring pattern, then returns to its original shape for mold release
2Ease of manufacture
If printing techniques are used to form wiring, then the process is simple and low-cost, but the minimum line width is limited to about 30 μm and aspect ratio is limited to 0.5
Solution Approach 1:
The patent replaces the printing mechanical system with a transfer molding system. Instead of depositing material through a screen or nozzle, the cured electroconductive paste is mechanically transferred from the mold cavity to the substrate. This substitution enables precise pattern transfer at nano-level dimensions while maintaining process simplicity
Solution Approach 2:
The patent performs preliminary curing of the electroconductive paste within the mold cavity before transfer. This preliminary action solidifies the paste into the desired wiring pattern with high aspect ratio, preventing spreading and drooping that occur with uncured paste in printing methods, thereby achieving both precision and ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of transfer wiring on substrates with recesses and protrusions without the need for a smoothing process, reducing effort and cost while improving throughput and reducing pattern shrinkage and stress on the wiring.
Implementation Method 1
a transfer mold 4 deforms in accordance with the recesses and protrusions, and pressure contact is carried out such that the surface of the transfer mold 4 comes into close contact with the surface of the substrate 1
Data Source
AI summary
Provided is an unprecedented and innovative wiring formation method with which it is possible to form transfer wiring using a transfer mold on a substrate having recesses and protrusions on the surface, without carrying out a smoothing process. The wiring formation method includes filling recesses (4a) arranged in a prescribed pattern in a transfer mold (4) having the recesses (4a) with an electroconductive member (2), laying the transfer mold (4) filled with the electroconductive member (2) over the surface of a substrate (1) having recesses and protrusions, transferring the electroconductive member (2) to the surface of the substrate (1), and forming a wiring part (3) on the surface of the substrate (1) using the electroconductive member (2), wherein a soft mold having a durometer A hardness of 40-70 is used as the transfer mold (4).