Soft Solder Contacts for Low-Force Socket Assemblies
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Solution Overview
Problem
As high-performance integrated circuits increase in complexity, the force required to seat processors in socket assemblies also increases, leading to potential damage and misalignment issues with fragile socket contacts and die packages.
Innovation Solution
The use of soft solder contacts that facilitate electrical connections between socket pins and die package contacts under lower load forces, composed of materials like indium or indium-based alloys, which provide reduced contact resistance and improved conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If higher load forces are applied to seat the processor, then proper electrical connection between pins and pads is achieved, but the risk of bending or cracking fragile socket contacts and die packages increases
Solution Approach 1:
The patent changes the material parameter of the contact surface by applying a soft solder coating (such as tin, lead, or lead-free solder alloys) on the pin contacts. This material parameter change allows the contact to achieve proper electrical connection at lower load forces compared to hard gold contacts, thereby reducing the risk of damage to fragile socket contacts and die packages while maintaining reliable electrical connection.
Solution Approach 2:
The patent uses a composite contact structure consisting of a base metal pin (providing mechanical strength) coated with a soft solder material (providing low-contact resistance and compliance). This composite material approach combines the advantages of both materials: the structural integrity of the base metal with the compliant, low-force contact properties of the soft solder layer.
2Object-affected harmful factors
If soft solder contacts are used to reduce load forces, then damage risk to fragile components is reduced, but contact resistance may increase compared to hard metal contacts
Solution Approach 1:
The patent optimizes the soft solder material parameters by selecting specific solder alloys (such as tin-lead or lead-free solder compositions) that balance softness for low contact force with electrical conductivity to maintain low contact resistance. The solder layer thickness and microstructure are also controlled to ensure adequate conductivity while maintaining the compliant contact properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable electrical connections with reduced risk of damage to socket contacts and die packages by allowing for secure coupling at lower forces, maintaining conductivity with resistance below 25 mOhm and strain rates suitable for lower pressure applications.
Implementation Method 1
soft solder contacts that facilitate electrical connections between socket pins and die package contacts under lower load forces
Implementation Method 2
soft solder contacts that facilitate electrical connections between socket pins and die package contacts
Data Source
AI summary
Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.