Soft Suction Structure for Semiconductor Substrate Handling
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Solution Overview
Problem
Existing methods for fixing semiconductor substrates, especially those that are extremely thin or have topography, face issues such as damage from vacuum paths and electrostatic charging, which hinder precise and safe handling.
Innovation Solution
A receiving device with a defined suction structure made of soft, flexible material that contacts the substrate, featuring a suction structure with specific geometry and Shore hardness, allowing gentle and stable fixation while avoiding electrostatic issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a flat hardened surface with vacuum channels is used for fixation, then fixation strength is improved, but thin semiconductor substrates break or are damaged along the vacuum channels
Solution Approach 1:
The patent applies a flexible membrane with integrated suction openings instead of a rigid hardened surface. The membrane can deform to accommodate substrate topography while maintaining suction force, eliminating the damage caused by rigid vacuum channels. The flexibility allows the membrane to conform to bumps and uneven surfaces without concentrating stress at specific points.
Solution Approach 2:
The patent changes the physical state and properties of the fixation surface from rigid to flexible. By using a compliant membrane material with specific elastic properties, the system transitions from a rigid vacuum fixation method to a flexible suction method that adapts to substrate variations, thereby preventing damage while maintaining fixation strength.
2Adaptability or versatility
If electrostatic fixing is used, then fixation capability for topographic substrates is improved, but complex circuits on substrates are likely to be damaged
Solution Approach 1:
The patent replaces the electrostatic field-based fixation method with a mechanical suction system. Instead of using electric fields to hold the substrate, the system uses controlled negative pressure through the flexible membrane to achieve fixation. This mechanical approach eliminates the harmful electric fields while maintaining the ability to handle topographic substrates effectively.
3Reliability
If known fixation methods are used for substrates with high topography, then fixation is attempted, but sufficient fixation degree cannot be achieved
Solution Approach 1:
The flexible membrane conforms to the substrate's topography, allowing uniform suction distribution across the entire substrate surface including areas with bumps and uneven features. This flexibility enables reliable fixation of topographic substrates that rigid systems cannot handle effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables safe and gentle handling of thin and topographically complex semiconductor substrates by distributing pressure evenly and preventing damage, while ensuring stable lateral guidance and avoiding electrostatic charges.
Implementation Method 1
A very common method of fixation uses a vacuum or negative pressure
Implementation Method 2
the suction structure with specific geometry and Shore hardness, allowing gentle and stable fixation
Data Source
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AI summary
The invention relates to a receiving device for receiving flat semiconductor substrates, having a carrier, a receiving body fixed on the carrier or that can be fixed on the carrier and having a receiving side facing away from the carrier and at least one vacuum channel permeating the receiving body and having a suction end on the receiving side, wherein the receiving side comprises a defined vacuum structure made of soft material.