Softened Composite Magnetic Material Embedding for Compact Inductors

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Solution Overview

Problem

Conventional methods for manufacturing power inductors with composite magnetic materials face challenges in reducing size while maintaining high self-inductance and allowable current, due to issues with separation of thin composite magnetic material and difficulty in molding thin side walls, leading to poor yield ratios and size limitations.

Innovation Solution

A method involving a coil forming step, press fitting the coil into a softened plate-shaped composite magnetic material, covering the coil with another softened plate-shaped material, pressurizing and molding the entire structure, and hardening the composite magnetic material to create a compact and rigid magnetic body around the coil.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the composite magnetic material is made thin to reduce component size, then the size of the electronic component is reduced, but the composite magnetic material easily separates at thin portions resulting in poor yield ratio

Engineering Contradiction:
Improvecomponent sizeVSAvoidyield ratio
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent changes the physical state parameter of the composite magnetic material from hardened to softened state during the embedding process. By softening the composite magnetic material before embedding the coil and then hardening it afterward, the material becomes more pliable during assembly, preventing separation at thin portions while maintaining the desired thin profile for size reduction.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies preliminary softening action to the composite magnetic material before the embedding process. This preliminary state change allows the material to be molded around the coil without separation, and the subsequent hardening locks the structure in place, ensuring both size reduction and high yield ratio.

Inventive Principle:
Principle #10Preliminary action

2Volume of moving object

If the composite magnetic material is made thin to reduce component size, then the size of the electronic component is reduced, but structural integrity deteriorates making manufacturing difficult

Engineering Contradiction:
Improvecomponent sizeVSAvoidstructural integrity
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent utilizes parameter change by transitioning the composite magnetic material between softened and hardened states. During the embedding process, the material is in a softened state allowing easy molding around the coil. After embedding, hardening restores full structural integrity, enabling thin-walled structures to maintain strength despite reduced thickness.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If conventional one-by-one manufacturing is used to maintain self-inductance, then high self-inductance is achieved, but manufacturing efficiency is low and size reduction is difficult

Engineering Contradiction:
Improveself-inductanceVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges multiple manufacturing operations into a single integrated process. By softening the composite magnetic material beforehand, the patent combines coil embedding, molding, and shaping into one simultaneous operation, eliminating the need for separate one-by-one manufacturing steps while maintaining self-inductance and improving efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the production of electronic components with high self-inductance and high allowable current at an excellent yield ratio, enabling size reduction without downsizing the coil, while maintaining structural integrity and efficiency in manufacturing.

Implementation Method 1

embedding the coil into a plate-shaped composite magnetic material in a state in which the plate-shaped composite magnetic material is softened

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

a pressurizing step of pressurizing and molding an entirety

Methodology Applied
Scientific EffectCompression: Compression

Implementation Method 3

a hardening step of hardening the composite magnetic material

Methodology Applied
Scientific EffectHardening: Phase Change

Data Source

PatentUS10026549B2Method of manufacturing an electronic component
Publication Date: 2018.07.17 MURATA MFG CO LTD
  • US10026549B2 patent drawing
  • US10026549B2 patent drawing
  • US10026549B2 patent drawing

AI summary

A method of manufacturing an electronic component includes: a coil forming step of forming a winding coil by a wire-shaped conductor; a press fitting step of embedding the winding coil into a plate-shaped composite magnetic material in a state in which the plate-shaped composite magnetic material is softened, the plate-shaped composite magnetic material being a composite magnetic material that is formed in a plate shape and in which magnetic particles and a resin are mixed; a covering step of covering a part of the winding coil with another plate-shaped composite magnetic material that is softened, the part of the coil being a part remaining uncovered in the press fitting step; a pressurizing step of pressurizing and molding an entirety; and, a hardening step of hardening the composite magnetic material.