SOI Optoelectronic Device With Cavity Mirror for Optical Turning
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Solution Overview
Problem
Existing optoelectronic devices emit light laterally, which hinders compact integration into consumer electronics and requires costly optical solutions with high losses.
Innovation Solution
An optoelectronic device with a silicon-on-insulator wafer, a cavity, and a micro-mirror bonded to a bed within the cavity, utilizing a ridge for alignment and underfill for refractive index matching, enabling low-loss out-of-plane optical turning and broadband performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If light is emitted from lateral edges of the device, then the device structure is simple, but compact integration into consumer electronics is hindered
Solution Approach 1:
The patent transitions light emission from the lateral edge dimension to the vertical dimension by using a top-emitting architecture. Light is guided through a waveguide and emitted through the upper surface of the device via a lens, enabling compact integration while maintaining manufacturing feasibility through established semiconductor fabrication processes.
2Loss of energy
If a mirror is added to enable out-of-plane optical turning, then optical performance is improved, but device complexity increases
Solution Approach 1:
The mirror is integrated directly into the cavity structure of the device, merging the optical turning function with the existing mechanical housing. This approach enables out-of-plane optical turning with minimal additional components, reducing overall device complexity while maintaining low optical loss through careful design of the mirror-cavity interface.
3Manufacturing precision
If alignment structures are added to ensure precise mirror positioning, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The alignment structures are designed to be self-aligning, where the mirror cavity automatically positions itself relative to the waveguide and lens components during assembly. This self-alignment mechanism ensures precise optical alignment without requiring complex external alignment procedures or additional active alignment components.
4Productivity
If the device is designed for high-volume manufacturing, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The device is segmented into modular components including the mirror assembly, waveguide structure, and lens element, each of which can be manufactured separately using standardized processes. This modularity enables high-volume production while maintaining precision through controlled assembly, as each component can be optimized for its specific manufacturing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates compact integration with reduced optical losses and enhanced reliability across a broad temperature range, suitable for high-volume manufacturing.
Implementation Method 1
a mirror, located within the cavity and bonded to a bed therefore, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer
Implementation Method 2
The underfill may be made of epoxy, or gel, and can provide refractive index matching (and so lower optical loss)
Implementation Method 3
The ridge structure provides a passive alignment structure for the mirror, and increases the dimensional accuracy of the structure. They allow fine alignment by fixing rotation, tilt, yaw, and X- or Y- shifts with respect to the input waveguide(s)
Implementation Method 4
The device may further comprise an anti-reflective coating, provided along one or more sidewalls and a bed of the cavity. The anti-reflective coating may be patterned for wavelength- or frequency-selective removal of light
Data Source
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AI summary
An optoelectronic device (100). The device (100) comprising: a silicon-on-insulator, SOI, wafer (120), the SOI wafer including a cavity (126) and an input waveguide (116), the input waveguide (116) being optically coupled into the cavity (126); and a mirror (110), located within the cavity (126) and bonded (128) to a bed thereof, the mirror (110) including a reflector (114) configured to reflect light (124) received from the input waveguide (116) in the SOI wafer (120).