SOI-Based LIDAR System Integration for Reduced Complexity

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Solution Overview

Problem

Current LIDAR systems are limited by high costs and complexity, making them unsuitable for compact, portable, and precise applications such as automotive driver assistance and aerosol detection, due to their reliance on expensive phased arrays and high laser power requirements.

Innovation Solution

A compact, integrated LIDAR system utilizing silicon-on-insulator (SOI)-based opto-electronic components, where both transmitter and receiver components are integrated within a single module, using CMOS fabrication processes and a Mach-Zehnder interferometer for scanning, allowing for lower cost and higher reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If phased array systems are used to achieve required field of view, then field of view is improved, but device complexity and cost increase significantly

Engineering Contradiction:
Improvefield of viewVSAvoidsystem complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines the laser source, modulator, and detector into a single integrated LIDAR module, eliminating the need for complex phased array systems. The integrated design achieves beam steering through a single element while maintaining wide field of view capability, thereby reducing device complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated LIDAR module performs multiple functions (transmission, modulation, detection, and beam steering) within a single compact unit, replacing the need for separate phased array components. This multi-functionality achieves the required field of view without the complexity of traditional phased array architectures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If multiple laser sources are used for aerosol detection, then measurement precision is improved, but device complexity and portability are worsened

Engineering Contradiction:
Improveaerosol detection precisionVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent integrates multiple detection capabilities into a single LIDAR module, allowing aerosol detection with multiple wavelengths or modes without requiring separate laser sources. This integration maintains measurement precision while significantly reducing device complexity and improving portability for field deployment.

Inventive Principle:
Principle #5Merging (Combining)

3Length of stationary object

If higher laser power is used to extend range, then range is improved, but safety regulations and system complexity are worsened

Engineering Contradiction:
Improvedetection rangeVSAvoidlaser power management complexity
Core Design Contradiction:
Length of stationary objectVSDevice complexity

Solution Approach 1:

The patent replaces mechanical beam steering and high-power laser systems with an integrated photonic circuit approach using Mach-Zehnder modulators. This substitution achieves extended detection range through efficient optical modulation and signal processing rather than brute-force high power, thereby reducing safety concerns and system complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Ease of manufacture

If discrete components are used for LIDAR system, then ease of manufacture is improved, but device complexity and cost increase

Engineering Contradiction:
Improvecomponent fabricationVSAvoidassembly complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent integrates multiple discrete LIDAR components (laser source, modulator, detector) into a single monolithic photonic circuit on a silicon chip. This integration maintains the manufacturing advantages of CMOS processes while eliminating the complexity of assembling and aligning multiple discrete components, thereby reducing both device complexity and manufacturing cost.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The SOI-based LIDAR system achieves a balance of cost-effectiveness and precision, enabling wider fields of view and longer ranges while maintaining portability, suitable for complex applications like automotive collision avoidance and aerosol detection.

Implementation Method 1

The light pulse strikes the target and is typically reflected back towards the LIDAR device

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

This return energy is then captured by an optical receiving element and converted from light energy to an electrical signal

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 3

The various optical and electrical components are formed utilizing portions of the SOI layer and applying well-known CMOS fabrication processes, including the formation of additional layer(s) over the SOI layer to provide the required devices. A laser source itself is attached to the SOI arrangement and coupled through an integrated modulation device (such as a Mach-Zehnder interferometer, i.e., MZI) to provide the scanning laser output signal

Methodology Applied
Scientific EffectInterference: Interference

Data Source

PatentUS7936448B2LIDAR system utilizing SOI-based opto-electronic components
Publication Date: 2011.05.03 CISCO TECHNOLOGY INC
  • US7936448B2 patent drawing
  • US7936448B2 patent drawing
  • US7936448B2 patent drawing

AI summary

A compact, integrated LIDAR system utilizes SOI-based opto-electronic components to provide for lower cost and higher reliability as compared to current LIDAR systems. Preferably, an SOI-based LIDAR transmitter and an SOI-based LIDAR receiver (both optical components and electrical components) are integrated within a single module. The various optical and electrical components are formed utilizing portions of the SOI layer and applying well-known CMOS fabrication processes (e.g., patterning, etching, doping), including the formation of additional layer(s) over the SOI layer to provide the required devices. A laser source itself is attached to the SOI arrangement and coupled through an integrated modulation device (such as a Mach-Zehnder interferometer, i.e., MZI) to provide the scanning laser output signal (the scan controlled by, for example, an electrical (encoder) input to the input to the MZI). The return, reflected optical signal is received by a photodetector integrated within the SOI arrangement, where it is thereafter converted into an electrical signal and subjected to various types of signal processing to perform the desired type(s) of signal characterization/signature analysis.