SOI Optical Waveguide Heater Wiring Integration
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Solution Overview
Problem
The manufacturing process of semiconductor devices with integrated optical waveguides is complex and costly, particularly in forming heaters above optical waveguides, which requires multiple steps and increases production expenses.
Innovation Solution
A semiconductor device design where a thin film heater with a smaller thickness is integrated with wiring parts on an insulating film above an optical waveguide, allowing for a simplified manufacturing process by combining the formation of the heater and wiring parts into fewer steps, reducing the overall complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heater is formed above an optical waveguide using conventional methods, then the optical waveguide can be heated for phase modulation, but the manufacturing process becomes complex and costly with multiple steps
Solution Approach 1:
The patent combines the heater and wiring parts into a single integrated structure formed by one continuous film. The heater portion is positioned above the optical waveguide while the wiring portions extend to external terminals, both formed simultaneously in the same manufacturing step, eliminating the need for separate heater formation and wiring fabrication processes
Solution Approach 2:
The conductive film serves multiple functions: it acts as a heater when current passes through the heater portion, and as electrical wiring when current flows through the wiring portions. This multi-functional design allows a single material layer to fulfill both heating and electrical connection requirements
2Manufacturing precision
If separate processes are used to form the heater and wiring parts, then each component can be optimized independently, but the manufacturing cost and number of steps increase
Solution Approach 1:
The heater and wiring parts are formed as an integrated structure using a single conductive film deposited in one manufacturing step. The film is patterned to create both the heater portion above the waveguide and the wiring portions leading to terminals, reducing fabrication steps while maintaining design flexibility
3Stability of the object's composition
If multiple manufacturing steps are used to form heater and wiring structures, then structural integrity can be ensured, but the production time and cost increase
Solution Approach 1:
The heater and wiring parts are formed simultaneously as a single integrated structure in one deposition and patterning step, significantly reducing manufacturing time and increasing production efficiency while maintaining structural integrity through continuous film formation
Solution Approach 2:
The conductive film is formed to simultaneously create both the heater and wiring structures in advance, before subsequent processing steps. This preliminary formation of the integrated structure prevents the need for additional alignment and fabrication steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens the manufacturing process and reduces costs by integrating the thin film heater and wiring parts, enhancing efficiency and reducing the number of necessary manufacturing steps while maintaining the functionality of the optical waveguide.
Implementation Method 1
a heater is formed above an optical waveguide formed on a part of a semiconductor substrate, the heater including a titanium nitride (TiN) film
Data Source
AI summary
An object of the present invention is to reduce the manufacturing cost of a semiconductor device. A semiconductor device includes a SOI substrate that has an optical waveguide including a semiconductor layer. The optical waveguide is covered with an interlayer insulating film. Wiring parts are formed on the interlayer insulating film. Moreover, a thin film part having a smaller thickness than the wiring parts is formed above the optical waveguide and is integrated with the wiring parts.