3D SoIC Direct Liquid Cooling Through Inter-Die Gaps
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Solution Overview
Problem
3D SoIC architectures face challenges with poor heat removal and high temperature gradients, limiting thermal design power (TDP) and device performance due to inadequate cooling solutions.
Innovation Solution
Implement direct localized cooling by utilizing gap fill regions as liquid cooling paths, pumping a cooling fluid through channels formed between dies to dissipate heat from hot spots, without requiring additional heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cooling solutions are used for 3D SoIC architectures, then device functionality and integration density are improved, but heat removal capability deteriorates and temperature gradients increase
Solution Approach 1:
The patent transitions from planar cooling to three-dimensional cooling by routing fluid channels through the vertical Z-height of the package. The fluid channel extends through gaps between dies in the top die layer, enabling cooling in the vertical dimension rather than only horizontal planes, thus effectively addressing heat removal in 3D stacked architectures.
Solution Approach 2:
The cooling system implements localized cooling by positioning the fluid channel to flow next to specific dies that generate heat. The channel can be configured to target hot spots in different locations, providing non-uniform cooling distribution matched to the thermal profile of individual dies rather than uniform cooling across the entire package.
2Temperature
If additional heat sinks are added to improve cooling, then heat removal is enhanced, but device complexity and package height increase
Solution Approach 1:
The patent merges the cooling function with the existing package structure by integrating the fluid channel into the gaps between dies that already exist in the 3D stacking architecture. Rather than adding separate heat sinks, the cooling pathway is combined with the inter-die spacing, eliminating the need for additional external cooling components.
Solution Approach 2:
The fluid channel serves multiple functions: it provides thermal management by removing heat from dies, maintains structural spacing between stacked dies, and enables direct liquid cooling without requiring separate heat dissipation components. This multi-functionality reduces overall package complexity.
3Temperature
If fluid channels are routed through gaps between dies, then direct localized cooling is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The fluid channel is formed and positioned during the packaging process before final die stacking. Gap fill regions are prepared in advance, and the fluid channel is routed through these pre-defined pathways, ensuring proper alignment with die gaps before the dies are permanently bonded together. This preliminary preparation reduces alignment difficulties during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances TDP capacity, enables higher peak power density, improves device performance at lower temperatures, and allows for thinner Z-height products with new stacking architectures, while maintaining minimal impact on silicon real estate.
Implementation Method 1
pumping a cooling fluid through channels formed between dies to dissipate heat from hot spots
Implementation Method 2
A pump can pump fluid through the fluid channel
Data Source
AI summary
The disclosed device includes a bottom die layer comprising a bottom die and a top die layer positioned on the bottom die layer and comprising a plurality of top dies and at least one gap between two of the plurality of top dies. The device also includes a cover encapsulating the bottom die layer and the top die layer and comprising an inlet and an outlet for a fluid channel, wherein the fluid channel includes the at least one gap. Various other methods, systems, and computer-readable media are also disclosed.