SoIC Die Stack Layout Spacing to Prevent Bond Delamination
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Solution Overview
Problem
SoIC die stacks experience chip delamination due to weak bonding interfaces, leading to open circuits and defective structures when subjected to external impacts.
Innovation Solution
Implementing design rule checks to ensure lateral distances between the SoIC die stack and neighboring components, interposer edges, and package substrate edges exceed specific threshold distances to prevent collisions and delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lateral spacing between SoIC die stack and neighboring components is increased to prevent delamination, then reliability is improved, but package area is increased
Solution Approach 1:
The patent transitions from two-dimensional planar packaging to three-dimensional stacked packaging by implementing die stacks with multiple dies bonded vertically. This vertical integration allows components to be arranged in the Z-dimension rather than only in the XY-plane, achieving higher integration density without increasing lateral package footprint. The design rule checks ensure adequate lateral spacing for reliability while the 3D stacking enables compact form factor.
2Stability of the object's composition
If design rule checks are implemented to ensure adequate lateral spacing, then structural integrity is improved, but manufacturing complexity is increased
Solution Approach 1:
The patent implements design rule checks during the design and fabrication planning stages to pre-establish adequate lateral spacing between die stacks and neighboring components. By performing these checks before actual assembly and bonding operations, potential structural integrity issues are identified and resolved in advance, preventing delamination problems during manufacturing and operation without adding complex real-time monitoring or adjustment mechanisms.
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes: an interposer; a System on Integrated Chips (SoIC) die stack bonded to a top surface of the interposer, the SoIC die stack comprising two or more dies bonded together; and a plurality of chips bonded to the top surface of the interposer. A first lateral distance, in a first direction, between a first boundary of the SoIC die stack and a boundary of a neighboring chip among the plurality of chips is larger than a first threshold distance.