Solar Cell Solder Strip Bonding With Edge-Reinforced Adhesive Dots
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Solution Overview
Problem
Solar cells without main grid electrodes face issues of loose connections during production, leading to poor reliability and increased rework, due to unstable bonding between solder strips and cell substrates, which can be exacerbated by gravity and encapsulant film forces.
Innovation Solution
A solar cell design incorporating reinforced limiting adhesive dots with enhanced adhesion force at the edges and additional adhesive dots with lower adhesion force, ensuring stable bonding by increasing the adhesion force between the reinforced limiting adhesive dot and the solder strip, while maintaining light reception efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If main grid electrodes are eliminated to reduce material cost, then material cost decreases, but connection reliability deteriorates due to loose connections
Solution Approach 1:
The patent applies different adhesive properties to different regions: reinforced limiting adhesive dots with high adhesion force are placed at edge regions where solder strips are most vulnerable to detachment, while additional limiting adhesive dots with lower adhesion force are placed in inner regions. This local differentiation provides enhanced connection reliability at critical locations while maintaining cost benefits of the no-main-grid structure.
2Reliability
If adhesive force is increased to prevent loose connections, then connection reliability improves, but light reception efficiency deteriorates due to increased shading
Solution Approach 1:
The patent strategically locates reinforced limiting adhesive dots only at edge regions adjacent to solder strips, where connection reliability is most critical. The inner regions use additional limiting adhesive dots with lower adhesion force and smaller area. This spatial differentiation ensures strong bonding where needed while minimizing shading losses in the active light-receiving areas.
Solution Approach 2:
The patent applies adhesive dots with different adhesion forces selectively rather than uniformly across the entire cell. By using reinforced adhesive dots only partially at critical edge locations and lower-force dots elsewhere, the patent achieves sufficient connection reliability without the excessive shading that would result from using high-adhesion adhesive dots across the entire surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances structural stability and reduces rework by preventing detachment and misalignment of solder strips, improving reliability and maintaining light conversion efficiency.
Implementation Method 1
The reinforced limiting adhesive dot and the additional limiting adhesive dot are attached to the solder strip and the cell substrate. An adhesion force between the reinforced limiting adhesive dot and the solder strip is greater than that between the additional limiting adhesive dot and the solder strip.
Data Source
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AI summary
The present disclosure provides a solar cell, a solar cell string, and a photovoltaic module. The solar cell includes a cell substrate (100), a solder strip (200) arranged on the cell substrate, and a reinforced limiting adhesive dot (310) and an additional limiting adhesive dot (320) that are attached to the solder strip and the cell substrate. The cell substrate includes an adhesion-enhanced region immediately adj acent to at least one edge of the cell substrate, and an additional region (120) arranged at a side of the adhesion-enhanced region away from the at least one edge. The additional limiting adhesive dot is arranged in the additional region. The reinforced limiting adhesive dot is arranged in the adhesion-enhanced region. An adhesion force between the reinforced limiting adhesive dot and the solder strip is greater than that between the additional limiting adhesive dot and the solder strip.