Solar Cell Electrode Bonding Layer for UV-Stable Interconnect Adhesion
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Solution Overview
Problem
Solar cells for outer space applications face challenges with adhesive strength due to the presence of Mo(Se,S)2 and Ti(Se,S)2 layers, which reduce bonding effectiveness and increase the risk of electrical connection failure under temperature changes and UV exposure.
Innovation Solution
The electrode structure incorporates a wiring element with a group VI element, where the concentration distribution of this element is shifted from the interface with the electric conductor, promoting diffusion and enhancing adhesive strength through the use of bonding layers containing Al and Ag, which are easily chalcogenized, thereby improving the bonding between the electric conductor and the wiring element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If soldering or adhesion methods are used to bond the interconnector, then the bonding process is simple and low-cost, but the adhesive strength decreases under temperature changes and UV exposure, leading to electrical connection failure
Solution Approach 1:
A bonding layer comprising a group VI element (such as Se or S) is introduced as an intermediary between the interconnector and the chalcogenide layer. This bonding layer acts as a mediator that enhances adhesion by forming strong chemical bonds with both the interconnector and the chalcogenide layer, while being resistant to degradation under temperature changes and UV exposure, thus solving the reliability issue without complicating the manufacturing process
Solution Approach 2:
The invention changes the chemical composition parameter by introducing a bonding layer with specific group VI element content between the interconnector and the chalcogenide layer. This parameter change creates a transition zone that maintains stable chemical bonds under varying temperature and UV conditions, preventing the adhesive strength degradation that occurs with conventional soldering or adhesion methods
2Reliability
If a bonding layer containing group VI element is introduced between the interconnector and the chalcogenide layer, then the adhesive strength is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The bonding layer is formed as a preliminary step before mounting the interconnector to the solar cell. By preparing the bonding layer in advance on the chalcogenide layer, the subsequent interconnector mounting process is simplified, and the overall manufacturing complexity is minimized while still achieving enhanced adhesive strength
Solution Approach 2:
The bonding layer is designed to be formed through self-organization or self-assembling processes during the solar cell manufacturing sequence, where the group VI element naturally migrates or deposits to form the bonding interface. This self-service approach reduces the need for additional complex manufacturing steps while achieving the desired bonding enhancement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances the adhesive strength between the electric conductor and the wiring element, ensuring reliable electrical connections even under extreme conditions, such as high temperatures and UV exposure.
Implementation Method 1
the concentration distribution of this element is shifted from the interface with the electric conductor, promoting diffusion and enhancing adhesive strength
Data Source
AI summary
An electrode structure of a solar cell includes an electric conductor on a substrate side of a chalcogen solar cell, and a wiring element to be electrically connected with the electric conductor. The wiring element is stacked on and bonded with the electric conductor. The wiring element and the electric conductor each contain a group VI element. In a stacked direction of the electric conductor and the wiring element, a peak of a concentration distribution of the group VI element is shifted from an interface between the electric conductor and the wiring element.