Solar Cell Backside Busbar Bridging for Efficient Metallization
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Solution Overview
Problem
Current metallization methods for solar cells are inefficient and costly, requiring improvements in forming conductive contacts to enhance solar cell efficiency and manufacturing processes.
Innovation Solution
The method involves forming semiconductor regions, contact fingers, and conductive busbars on a semiconductor substrate using techniques such as plasma-enhanced chemical vapor deposition and bonding conductive foils, with processes like laser welding and plating to create efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional metallization methods are used for forming conductive contacts, then the manufacturing process is simpler, but the efficiency and cost-effectiveness are poor
Solution Approach 1:
The metallization process is divided into distinct stages: forming a metal seed layer, depositing a first metal layer, and depositing a second metal layer. Each layer serves a specific function and can be optimized independently, improving overall manufacturing efficiency while maintaining process simplicity
Solution Approach 2:
A metal seed layer is formed first on the semiconductor substrate before subsequent metal layers are deposited. This preliminary action prepares the surface for better adhesion and conductivity, enabling more efficient metallization processes
2Reliability
If conventional metallization methods are used, then the process steps are fewer, but the electrical performance is inferior
Solution Approach 1:
The patent uses composite metallization structures combining different metal materials with complementary properties. The first metal layer provides adhesion and basic conductivity, while the second metal layer enhances electrical performance, creating a composite structure that achieves superior electrical performance without excessive complexity
3Ease of manufacture
If traditional conductive contact formation is used, then the manufacturing cost is lower, but the production cost is higher
Solution Approach 1:
Multiple metallization functions are merged into a single integrated process sequence. The metal seed layer formation, first metal layer deposition, and second metal layer deposition are combined in one continuous manufacturing flow, reducing production costs through process integration and eliminating the need for separate manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the efficiency and cost-effectiveness of solar cell manufacturing by improving the formation of conductive contacts, leading to enhanced electrical performance and reduced production costs.
Implementation Method 1
forming contact fingers and conductive busbars on a semiconductor substrate using techniques such as plasma-enhanced chemical vapor deposition
Implementation Method 2
with processes like laser welding and plating to create efficient electrical connections
Implementation Method 3
with processes like laser welding and plating to create efficient electrical connections
Data Source
AI summary
Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, forming a first semiconductor region and a second semiconductor region on the back side of a substrate. A first conductive busbar can be formed above the first semiconductor region. A first portion of a second conductive busbar can be formed above the second semiconductor region. A second portion of the second conductive busbar can be formed above the second semiconductor region, where a separation region separates the second portion and the first portion of the second conductive busbar. A third conductive busbar can be formed above the first semiconductor region. A first conductive bridge can be formed above the separation region, where the first conductive bridge electrically connects the first conductive busbar to the third conductive busbar.