Solar Cell Module Conductive Line Fixation via Insulating Adhesive

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Solution Overview

Problem

The manufacturing process of solar cell modules is hindered by the instability of conductive lines on the back surface of semiconductor substrates, which can lead to misalignment and poor adhesion, affecting the module's efficiency and reliability.

Innovation Solution

The use of an insulating adhesive portion, composed of a polyolefin-based insulating tape with a melting point below 170°C, is applied to fix conductive lines and electrodes to the semiconductor substrate, ensuring proper alignment and adhesion during the lamination process, thereby stabilizing the conductive lines and preventing corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conductive lines are disposed on the back surface of the semiconductor substrate without fixation, then the manufacturing process is simpler, but the conductive lines may move and become misaligned, reducing manufacturing precision

Engineering Contradiction:
Improvesimplicity of conductive line disposalVSAvoidalignment precision of conductive lines
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The insulating adhesive portion is applied to the back surface of the semiconductor substrate before the conductive lines are disposed. This preliminary action creates a fixation structure that prevents misalignment during subsequent manufacturing steps, resolving the contradiction by enabling both simple disposal and precise alignment.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The insulating adhesive portion acts as an intermediary between the semiconductor substrate and the conductive lines. It provides a bonding interface that secures the conductive lines in their intended positions, allowing simple placement while ensuring precise alignment through the adhesive's fixing action.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If conductive lines are fixed using conventional adhesive methods, then alignment is improved, but adhesion reliability is insufficient leading to poor bonding

Engineering Contradiction:
Improvealignment precision of conductive linesVSAvoidadhesion reliability of conductive lines
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The insulating adhesive portion is composed of a base film and an insulating adhesive layer, creating a composite structure. The base film provides mechanical strength and positioning, while the insulating adhesive layer provides strong bonding to the conductive lines, thereby achieving both precise alignment and reliable adhesion.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The insulating adhesive portion undergoes parameter changes during the lamination process, where heat and pressure cause the insulating adhesive to soften and flow into the gaps between the conductive lines and substrate, then固化 to create strong bonding. This parameter change enables reliable adhesion while maintaining alignment precision.

Inventive Principle:
Principle #35Parameter changes

3Strength

If the insulating adhesive portion is applied extensively, then fixation strength is improved, but material usage and process complexity increase

Engineering Contradiction:
Improvefixation strength of conductive linesVSAvoidcomplexity of adhesive application
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The insulating adhesive portion is applied selectively at specific locations where conductive lines need fixation, rather than uniformly across the entire substrate. This local application provides sufficient fixation strength at critical points while minimizing material usage and reducing process complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the manufacturing process by securely attaching conductive lines to the substrate, reducing the risk of misalignment and corrosion, and improving the overall efficiency and reliability of the solar cell module.

Implementation Method 1

an insulating adhesive portion extending in a first direction on at least a portion of a surface of the semiconductor substrate, on which the conductive lines are disposed, and fixing the conductive lines to the semiconductor substrate and the first and second electrodes

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

the conductive lines being connected to the first electrodes or the second electrodes through a conductive adhesive

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

When light is incident on the solar cell, a plurality of electron-hole pairs are produced in the semiconductor parts and are separated into electrons and holes by the incident light

Methodology Applied
Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Data Source

PatentUS11152525B2Solar cell module
Publication Date: 2021.10.19 SHANGRAO JINKO SOLAR TECH DEV CO LTD
  • US11152525B2 patent drawing
  • US11152525B2 patent drawing
  • US11152525B2 patent drawing

AI summary

A solar cell module includes solar cells each including a semiconductor substrate and first and second electrodes that extend in a first direction on a surface of the semiconductor substrate and have different polarities; conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate included in each solar cell and connected to the first electrodes or the second electrodes through a conductive adhesive; and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and temporarily fixing the conductive lines to the semiconductor substrate and the first and second electrodes, the insulating adhesive portion being attached on a back surface of least a portion of each conductive line as well as a side surface of at least a portion of each conductive line.